PEMIxCSP family Integrated 4-, 6- and 8-channel passive filter network with ESD protection Rev. 2 27 January 2012 Product data sheet 1. Product profile 1.1 General description The devices are a family of 4-, 6- and 8-channel RC low pass filters which are designed to provide filtering of undesired RF signals on the I/O ports of portable communication or computing devices. In addition the devices incorporate diodes to provide protection to downstream components from ElectroStatic Discharge (ESD) voltages up to 20 kV. The PEMIxCSP family is fabricated using monolithic silicon technology and integrates up to eight resistors and 16 protection diodes in a single Wafer Level Chip-Size Package (WLCSP). These features make the devices ideal for use in applications requiring the utmost in miniaturization such as mobile phone handsets, cordless telephones and personal digital devices. 1.2 Features and benefits Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen and antimony (Dark Green compliant) Integrated 4-, 6- and 8-channel -type RC filter network Channel series resistance R =100 s(ch) Channel capacitance C = 23 or 30 pF at V =2.5 V ch bias(DC) Channel capacitance C = 41 or 54 pF at V =0V ch bias(DC) Available in 10, 15 and 20-ball WLCSP ESD protection up to 20 kV contact discharge according to IEC 61000-4-2, far exceeding level 4 1.3 Applications General-purpose ElectroMagnetic Interference (EMI) and Radio-Frequency Interference (RFI) filtering and downstream ESD protection for: Cellular phone and Personal Communication Systems (PCS) mobile handsets Cordless telephones Wireless data (WAN/LAN) systemsPEMIxCSP family NXP Semiconductors 4-, 6- and 8-channel passive filter network with ESD protection 2. Pinning information 2.1 Pinning bump A1 bump A1 index area index area 1 2 3 4 1 2 3 4 5 6 A A B B1 B2 B B1 B2 B3 C C 001aak062 001aak063 transparent top view, transparent top view, solder balls facing down solder balls facing down Fig 1. PEMI4CSP: pin configuration Fig 2. PEMI6CSP: pin configuration bump A1 index area 1 2 3 4 5 6 7 8 A B B1 B2 B3 B4 C 001aak064 transparent top view, solder balls facing down Fig 3. PEMI8CSP: pin configuration 2.2 Pin description Table 1. Pinning Pin Description PEMI4CSP PEMI6CSP PEMI8CSP A1 and C1 A1 and C1 A1 and C1 filter channel 1 A2 and C2 A2 and C2 A2 and C2 filter channel 2 A3 and C3 A3 and C3 A3 and C3 filter channel 3 A4 and C4 A4 and C4 A4 and C4 filter channel 4 - A5 and C5 A5 and C5 filter channel 5 - A6 and C6 A6 and C6 filter channel 6 - - A7 and C7 filter channel 7 - - A8 and C8 filter channel 8 B1 and B2 B1, B2 and B3 B1, B2, B3 and B4 ground (GND) PEMIXCSP FAM All information provided in this document is subject to legal disclaimers. NXP B.V. 2012. All rights reserved. Product data sheet Rev. 2 27 January 2012 2 of 16