PUSB3FR6 NXP

PUSB3FR6 ESD protection for ultra high-speed interfaces Rev. 1 25 February 2015 Product data sheet 1. Product profile 1.1 General description The device is designed to protect high-speed interfaces such as SuperSpeed and Hi-Speed USB combination, SD-memory card 3.0 and thunderbolt interfaces against ElectroStatic Discharge (ESD). The device includes six high-level ESD protection diode structures for ultra high-speed signal lines. The device is encapsulated in a leadless ultra small DFN2111-7 (SOT1358-1) Surface-Mounted Device (SMD) plastic package. All signal lines are protected by a special diode structure offering ultra low line capacitance of only 0.35 pF. These diodes utilize a snap-back structure in order to provide protection to downstream components from ESD voltages up to 15 kV contact exceeding IEC 61000-4-2, level 4. 1.2 Features and benefits System-level ESD protection for USB 2.0 and USB 3.1 combination, SD-memory card and thunderbolt interfaces Supports SuperSpeed USB 3.1 at 10 Gbps All signal lines with integrated rail-to-rail clamping diodes for downstream ESD protection of 15 kV exceeding IEC 61000-4-2, level 4 Matched 0.5 mm trace spacing Line capacitance of only 0.35 pF for each channel Design-friendly pass-through signal routing 1.3 Applications The device is designed for high-speed receiver and transmitter port protection: Portable and wearable devices Smartphones and tablet PCs TVs and monitors DVD recorders and players Notebooks, main board graphic cards and ports Set-top boxes and game consoles XSON7PUSB3FR6 NXP Semiconductors ESD protection for ultra high-speed interfaces 2. Pinning information Table 1. Pinning Pin Symbol Description Simplified outline Graphic symbol 1 CH1 channel 1 ESD protection 13645 7 2 GND ground 1 3 CH2 channel 2 ESD protection 7 2 4 CH3 channel 3 ESD protection 2 5 CH4 channel 4 ESD protection 6 3 6 CH5 channel 5 ESD protection 5 7 CH6 channel 6 ESD protection 4 = Transparent top view aaa-016877 3. Ordering information Table 2. Ordering information Type number Package Name Description Version PUSB3FR6 DFN2111-7 plastic extremely thin small outline package SOT1358-1 no leads 7 terminals body 1.1 2.1 0.5 mm 4. Marking Table 3. Marking codes Type number Marking code PUSB3FR6 FR 5. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit V input voltage 0.5 +3.3 V I 1 V electrostatic discharge IEC 61000-4-2, level 4 ESD voltage contact discharge 15 +15 kV air discharge 15 +15 kV I rated peak pulse current t =8/20 s 77 A PPM p T ambient temperature 40 +85 C amb T storage temperature 55 +125 C stg 1 All pins to ground. PUSB3FR6 All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 1 25 February 2015 2 of 12