X-On Electronics has gained recognition as a prominent supplier of PX1011BI-EL1/G,551 PCI Interface IC across the USA, India, Europe, Australia, and various other global locations. PX1011BI-EL1/G,551 PCI Interface IC are a product manufactured by NXP. We provide cost-effective solutions for PCI Interface IC, ensuring timely deliveries around the world.

PX1011BI-EL1/G,551 NXP

PX1011BI-EL1/G,551 electronic component of NXP
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Part No.PX1011BI-EL1/G,551
Manufacturer: NXP
Category: PCI Interface IC
Description: PHY 1-CH 81-Pin LFBGA Tray
Datasheet: PX1011BI-EL1/G,551 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
260: USD 8.5641 ea
Line Total: USD 2226.67 
Availability - 0
MOQ: 260  Multiples: 260
Pack Size: 260
Availability Price Quantity
0
Ship by Mon. 30 Dec to Fri. 03 Jan
MOQ : 260
Multiples : 260
260 : USD 8.5641

   
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We are delighted to provide the PX1011BI-EL1/G,551 from our PCI Interface IC category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the PX1011BI-EL1/G,551 and other electronic components in the PCI Interface IC category and beyond.

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PX1011B PCI Express stand-alone X1 PHY Rev. 6 27 June 2011 Product data sheet 1. General description The PX1011B is a high-performance, low-power, single-lane PCI Express electrical PHYsical layer (PHY) that handles the low level PCI Express protocol and signaling. The PX1011B PCI Express PHY is compliant to the PCI Express Base Specification, Rev. 1.0a, and Rev. 1.1. The PX1011B includes features such as Clock and Data Recovery (CDR), data serialization and de-serialization, 8b/10b encoding, analog buffers, elastic buffer and receiver detection, and provides superior performance to the Media Access Control (MAC) layer devices. The PX1011B is a 2.5 Gbit/s PCI Express PHY with 8-bit data PXPIPE interface. Its PXPIPE interface is a superset of the PHY Interface for the PCI Express (PIPE) specification, enhanced and adapted for off-chip applications with the introduction of a source synchronous clock for transmit and receive data. The 8-bit data interface operates at 250 MHz with SSTL 2 signaling. The SSTL 2 signaling is compatible with the I/O interfaces available in FPGA products. The PX1011B PCI Express PHY supports advanced power management functions. The PX1011BI is for the industrial temperature range ( 40 C to +85 C). Automotive AEC-Q100 compliant version PX1011B-EL1/Q900 is available. 2. Features and benefits 2.1 PCI Express interface Compliant to PCI Express Base Specification 1.1 Single PCI Express 2.5 Gbit/s lane Data and clock recovery from serial stream Serializer and De-serializer (SerDes) Receiver detection 8b/10b coding and decoding, elastic buffer and word alignment Supports loopback Supports direct disparity control for use in transmitting compliance pattern Supports lane polarity inversion Low jitter and Bit Error Rate (BER) 2.2 PHY/MAC interface Based on Intel PHY Interface for PCI Express architecture v1.0 (PIPE) Adapted for off-chip with additional synchronous clock signals (PXPIPE) 8-bit parallel data interface for transmit and receive at 250 MHz 2.5 V SSTL 2 class I signalingPX1011B NXP Semiconductors PCI Express stand-alone X1 PHY 2.3 JTAG interface JTAG (IEEE 1149.1) boundary scan interface Built-In Self Test (BIST) controller tests SerDes and I/O blocks at speed 3.3 V CMOS signaling 2.4 Power management Dissipates < 300 mW in L0 normal mode Support power management of L0, L0s and L1 2.5 Clock 100 MHz external reference clock with 300 ppm tolerance Supports spread spectrum clock to reduce EMI On-chip reference clock termination 2.6 Miscellaneous LFBGA81 leaded or lead-free packages Operating ambient temperature Commercial: 0 C to +70 C Industrial: 40 C to +85 C ESD protection voltage for Human Body Model (HBM): 2000 V 3. Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit V digital supply voltage 1 for JTAG I/O 3.0 3.3 3.6 V DDD1 V digital supply voltage 2 for SSTL 2 I/O 2.3 2.5 2.7 V DDD2 V digital supply voltage 3 for core 1.15 1.2 1.3 V DDD3 V supply voltage for high-speed 1.15 1.2 1.3 V DD serial I/O and PVT V analog supply voltage 1 for serializer 1.15 1.2 1.3 V DDA1 V analog supply voltage 2 for serializer 3.0 3.3 3.6 V DDA2 f reference clock frequency 99.97 100 100.03 MHz clk(ref) T ambient temperature operating amb commercial 0 - +70 C industrial 40 - +85 C PX1011B All information provided in this document is subject to legal disclaimers. NXP B.V. 2011. All rights reserved. Product data sheet Rev. 6 27 June 2011 2 of 32

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8542.39.23 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products Free

Electronic integrated circuits- Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
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