Ultra-low-power Bluetooth 5 SIP QN9080-001-M17: Fully certified module supporting Bluetooth and NFC The QN9080SIP, an ultra-small module based on the QN9080 Bluetooth MCU and NT3H2211 NTAG , delivers industry-leading low power consumption along with a rich feature set and FCC/CE/IC/MIC certification making it an ideal solution for wearables and battery powered applications. TARGET APPLICATIONS fusion sensor co-processor (FSP) to further reduce power consumption by offloading complex math computations Wearables and consumer accessories from the CPU. The 512 KB onboard flash and 128 KB SRAM Health and medical devices provide enough room and flexibility for complex applications Sports and fitness trackers and the connectivity stacks. Building and home automation The module also integrates NFC NTAG, 32 MHz & 32 kHz Crystals, RF matching and 2.4 GHz antenna, and a DC-DC Retail and advertising beacons converter circuit and is certified to FCC, CE, IC, and MIC OVERVIEW regulations offering a complete and ready-to-use solution solution for applications requiring Bluetooth Low Energy Supporting Bluetooth 5, the QN9080SIP module is designed wireless connectivity and simple pairing with NFC NTAG. This to power the next generation of ultra-small, portable level of integration reduces overall system size, complexity connected wireless devices, providing easy pairing with NFC and shortens the development time. Fully qualified and NTAG. certified module eliminates the time for design, development Designed to be a well-suited enabler for NFC in home- and certification processes automation and consumer applications, this feature-packed, second-generation connected NFC tag is the fastest, least expensive way to add tap-and-go connectivity to just about any electronic device. The QN9080SIP integrates NTAG for out-of-band pairing. By tapping an IoT device based on the QN9080SIP with an NFC reader embedded device, a Bluetooth Low Energy connection can be established quickly simplifying the pairing process. The module is based on the QN9080 Bluetooth MCU powered by an Arm Cortex-M4F, and integrates a dedicated ENABLEMENT QN9080SIP BLOCK DIAGRAM QN908SIP BLOCK DIAGRAM NXP offers a Development Kit containing QN9080 Die one development board and one USB Integrated Arm Cortex-M4F Bluetooth ROM dongle to speed time to market and Antenna (32 MHz) LE BB/RF Flash Interrupt Controller Balun reduce development costs. 512 KB Transceiver RAM Debug Matching 128 KB The QN9080SIP reuses the software Core AES-128 Quad SPI development platform of the QN9080 Memory TRNG Fusion Sensor Processor (FSP) Bluetooth Low Energy MCU and includes Flexcomm (4) Security Co-processing 2 I C/SPI/USART 16-bit Sigma-Delta ADC a rich suite of example applications 32 MHz WDT USB 2.0 FS (8) crystal and software in a complete software GPIO 8-bit DAC DMA (Up to 35) 32.768 kHz development kit (SDK) compatible with PowerManagement Comm, GPIO Low-Power Comparator (2) crystal (DC-DC/LDO) General Purpose the latest toolchains from Arm-Keil, IAR, POR/BOD (4) Temperature Sensor System and NXPs MCUXpresso. MCUXpresso SCT/PWM Battery Monitor Quadrature Decoder provides a seamless software portfolio Internal Oscillators Analog (2) 2 NTAG I C plus Capacitive Touch NT3H2211 die among all NXP devices as well as a External Oscillators RTC (8) Clock Timers, PWM, IC/OC HMI fast path to add Bluetooth Low Energy capability to existing code based on another NXP device. The software is fully compitable with QN9080. A reference example for Bluetooth Low Energy pairing using NFC is also offered on NXP website. QN9080SIP BLUETOOTH SMART WIRELESS MODULE FEATURES AND BENEFITS Features Benefits 4 mA TX / 4.4 mA RX peak current, Extends battery life and allows for smaller form-factors DC-DC enabled -92.7 dB RX sensitivity High sensitivity allows for a more robust link budget -20 dBm to +2 dBm TX output power 32 MHz Arm Cortex M4F core 512 High-performance Arm core with ample room for user applications KB flash memory 128 KB SRAM 32 MHz Fusion Sensor Processor (FSP) Co-processor allows for hardware acceleration of complex sensor fusion algorithms Compatible with Keil, IAR and Example projects support industry standard Keil and IAR toolchains. MCUXpresso SDKs MCUXpresso support allows for easy code migration based on other NXP devices. LE 2M PHY with Bluetooth 5 qualified Doubles data throughput for more use cases, lowers average power Supports up to 16 simultaneous links consumption, and allows for the creation of large, complex BLE sensor networks 6 x9.7x1.11 mm SIP packaging Small packages with low component count reduces overall system size and cost Integrates NFC Forum Type 2 Tag - Simplifies Bluetooth Low Energy device paring, improves the user NT3H2211 experience Certified to FCC, CE, IC, MIC Fully qualified and certified module eliminates the time for design, regulations development and certification processes PART NUMBERS Part Number 2.4 GHz RF Capability Flash / RAM (KB) Package (mm) QN9080-001-M17 Bluetooth 5, 2.4 GHz proprietary 512 / 128 6 x 9.71 x 1.1 LGA Part Number Description QN9080SIP-DK Development Kit www.nxp.com/QN9080SIP NXP, the NXP logo and NTAG are trademarks of NXP B.V. All other product or service names are the property of their respective owners. 2020 NXP B.V. Document Number: QN9080SIPFS REV 1