S32R372141EVB NXP

Document Number S32R372 NXP Semiconductors Rev. 4, 08/2018 Data Sheet: Technical Data S32R372 S32R372 Data Sheet Features Security Cryptographic Security Engine (CSE2) Dual issue computation cores: Power Architecture Supports censorship and life-cycle management e200z7 32-bit CPU Timers 1.3 MB on-chip code flash memory (FMC flash Two Periodic Interval Timers (PIT) with 32-bit memory) with ECC counter resolution 1 MB on-chip SRAM with ECC Two System Timer Module (STM) Two Software Watchdog Timers (SWT) RADAR processing One eTimer module with 6 channels each Signal Processing Toolbox (SPT) for RADAR signal One FlexPWM module for 12 PWM signals processing acceleration Cross Triggering Engine (CTE) for precise timing Communication interfaces generation and triggering Two Serial Peripheral interface (SPI) modules MIPICSI2 interface to connect external RADAR RX One LINFlexD module ADCs Two inter-IC communication interface (I2C) modules Memory protection Two FlexCAN modules supporting CAN FD with Each core memory protection unit provides 24 configurable buffers entries Data and instruction bus system memory protection Debug functionality unit (SMPU) with 16 region descriptors each 4-pin JTAG interface and Nexus/Aurora interface Register protection for serial high-speed tracing e200z7 core: Nexus development interface (NDI) Clock generation per IEEE-ISTO 5001-2012 Class 3+ 40 MHz external crystal (XOSC) 16 MHz Internal oscillator (IRCOSC) Two analog-to-digital converters (SAR ADC) Dual system PLL with one frequency modulated Each ADC supports up to 16 input channels phase-locked loop (FMPLL) Cross Trigger Unit (CTU) Low-jitter PLL On-chip voltage DC/DC regulator for core supply Functional safety generation (VREG) Enables ASIL-B applications Two Temperature Sensors (TSENS) Fault Collection and Control Unit (FCCU) for fault collection and fault handling Memory Error Management Unit (MEMU) for memory error management Safe eDMA controller Self-Test Control Unit (STCU2) Error Injection Module (EIM) On-chip voltage monitoring Clock Monitor Unit (CMU) NXP reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products.Table of Contents 1 Introduction........................................................................................3 8.3 Flash memory module life specifications................................31 1.1 Chip comparison..................................................................... 3 8.4 Data retention vs program/erase cycles...................................32 1.2 Feature list...............................................................................4 8.5 Flash memory AC timing specifications.................................32 1.3 Block diagram......................................................................... 8 8.6 Flash memory read wait-state and address-pipeline control 2 Ordering parts.....................................................................................9 settings.....................................................................................33 2.1 Determining valid orderable parts...........................................9 9 Communication modules................................................................... 34 3 Part identification...............................................................................9 9.1 SPI timing specifications.........................................................34 3.1 Description.............................................................................. 9 9.2 LINFlexD timing specifications..............................................39 3.2 Format..................................................................................... 9 9.3 I2C timing .............................................................................. 39 3.3 Fields....................................................................................... 9 10 Debug modules...................................................................................40 4 General............................................................................................... 11 10.1 JTAG/CJTAG interface timing .............................................. 40 4.1 Introduction............................................................................. 11 10.2 Nexus Aurora debug port timing.............................................43 4.2 Absolute maximum ratings..................................................... 11 11 WKPU/NMI timing specifications.....................................................44 4.3 Operating conditions............................................................... 13 12 External interrupt timing (IRQ pin)................................................... 45 4.4 Supply current characteristics................................................. 14 13 Temperature sensor electrical characteristics.....................................45 4.5 Voltage regulator electrical characteristics............................. 15 14 Radar module..................................................................................... 46 4.6 Electromagnetic Compatibility (EMC) specifications............ 19 14.1 MIPICSI2 D-PHY electrical and timing specifications.......... 46 4.7 Electrostatic discharge (ESD) characteristics......................... 19 14.2 MIPICSI2 disclaimer...............................................................49 5 I/O Parameters....................................................................................20 15 Thermal characteristics...................................................................... 50 5.1 I/O pad DC electrical characteristics ......................................20 15.1 General notes for specifications at maximum junction 5.2 I/O pad AC specifications....................................................... 21 temperature..............................................................................51 5.3 Aurora LVDS driver electrical characteristics........................ 22 15.2 References............................................................................... 53 5.4 Reset pad electrical characteristics..........................................22 16 Packaging........................................................................................... 53 6 Peripheral operating requirements and behaviors..............................24 17 Reset sequence................................................................................... 54 6.1 Clocks and PLL Specifications............................................... 24 17.1 Reset sequence duration.......................................................... 54 7 Analog................................................................................................27 17.2 Reset sequence description......................................................54 7.1 ADC electrical characteristics.................................................27 18 Power sequencing requirements.........................................................57 8 Memory modules............................................................................... 29 19 Package pinouts and signal descriptions............................................58 8.1 Flash memory program and erase specifications.................... 29 20 Release Notes.....................................................................................59 8.2 Flash memory Array Integrity and Margin Read specifications...........................................................................30 S32R372 Data Sheet, Rev. 4, 08/2018 2 NXP Semiconductors