NXP Semiconductors Document Number: MC16XSD200 Rev. 4.0, 5/2018 Data Sheet: Advance Information Dual 16 mOhm high-side switch 16XSD200 The 16XSD200 device is part of a 36 V dual high-side switch product family with integrated control, and a high number of protective and diagnostic functions. It has been designed for industrial applications. The low R DS(ON) channels (<16 m) can control different load types bulbs, solenoids, or DC motors. Control, device configuration, and diagnostics are performed through a HIGH-SIDE SWITCH 16-bit serial peripheral interface (SPI), allowing easy integration into existing applications. This device is powered by SMARTMOS technology. Both channels can be controlled individually by external/internal clock signals, or by direct inputs. Using the internal clock allows fully autonomous device operation. Programmable output voltage slew-rates (individually programmable) helps improve electromagnetic compatibility (EMC) performance. To avoid shutting off the device upon inrush current, while still being able to closely track the load current, a dynamic overcurrent threshold profile is featured. Switching current of each channel can be sensed with a programmable sensing ratio. Whenever communication with the external microcontroller is lost, the device enters a Fail-safe operation mode, but remains operational, controllable, and protected. FK SUFFIX (PB-FREE) Features 98ASA00428D 23 PIN PQFN (12 X12 mm) Normal operating range: 8.0 to 36 V, extended range: 6.0 to 58 V Two fully-protected 16 m ( 25 C) high-side switches Up to 4.4 A steady state current per channel Separate bulb and DC motor latched overcurrent handling Individually programmable internal/external PWM clock signals Overcurrent, short-circuit, and overtemperature protection with programmable autoretry functions Accurate temperature and current sensing Openload detection (channel in OFF and ON state), also for LED applications (7.0 mA typ.) 3.3 V and 5.0 V compatible 16-bit SPI port for device control, configuration and diagnostics at rates up to 8.0 MHz V V V DD DD PWR 16XSD200 VDD VPWR I/O CLOCK I/O FSB SCLK SCLK HS0 CSB CSB LOAD SI SO MCU I/O RSTB SO SI HS1 I/O IN0 LOAD M I/O IN1 CONF0 CONF1 I/O FSOB A/D SYNC A/D CSNS GND GND Figure 1. Simplified application diagram * This document contains certain information on a new product. Specifications and information herein are subject to change without notice. NXP B.V. 2018.Table of Contents 1 Orderable parts 3 2 Internal block diagram . 3 3 Pin assignment 4 4 Electrical characteristics . 6 4.1 Maximum ratings . 6 4.2 Static electrical characteristics 7 4.3 Dynamic electrical characteristics . 15 4.4 Timing diagrams 20 5 Functional description 23 5.1 Introduction 23 5.2 Pin assignment and functions 23 5.3 Functional internal block description . 26 6 Functional device operation 27 6.1 Operation and operating modes 27 6.3 Logic commands and SPI registers . 46 7 Typical applications 56 8 Packaging . 58 8.1 Soldering information 58 8.2 Package dimensions . 59 9 Revision history . 67 16XSD200 NXP Semiconductors 2