X-On Electronics has gained recognition as a prominent supplier of XC7WT14GT unclassified across the USA, India, Europe, Australia, and various other global locations. XC7WT14GT unclassified are a product manufactured by NXP. We provide cost-effective solutions for unclassified, ensuring timely deliveries around the world.

XC7WT14GT

XC7WT14GT electronic component of NXP
Images are for reference only
See Product Specifications
Part No.XC7WT14GT
Manufacturer: NXP
Category:Unclassified
Description: IC, INV, SCHMITT TRIGGER, XSON8
Datasheet: XC7WT14GT Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 0.1073 ea
Line Total: USD 0.11

Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1

XC7WT14GT More Buying Options & Price Grid(s)

Availability Price Quantity
0 - WHS 1


Ships to you between Fri. 31 May to Thu. 06 Jun

MOQ : 1
Multiples : 1
1 : USD 0.1073

Read More Specifications

     
Manufacturer
Product Category
Logic Type
Output Current
No Of Inputs
Supply Voltage Min
Supply Voltage Max
Logic Case Style
No Of Pins
Operating Temperature Min
Operating Temperature Max
Packaging
Msl
Svhc
Operating Temperature Range
Supply Voltage Range
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We proudly offer the XC7WT14GT Unclassified at competitive prices in the United States, Australia, India, Europe and more. By maintaining strong relationships with manufacturers and optimizing our operations, we provide significant savings to our customers. Customer satisfaction is at the heart of our business. Our knowledgeable and friendly customer service team is always ready to assist you with any inquiries or issues. From product selection to after-sales support, we are dedicated to providing our customers with a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why we are the top choice for the XC7WT14GT Unclassified.

Additional Infomation About Product

AN10343 MicroPak soldering information Rev. 2 30 December 2010 Application note Document information Info Content Keywords MicroPak, footprint, Ball Grid Array (BGA), Wafer-Level Chip Scale Package (WLCSP) Abstract This application note describes evaluation of recommended solder land patterns for mounting MicroPak packagesAN10343 NXP Semiconductors MicroPak soldering information Revision history Rev Date Description v.2 20101230 text and graphics updated to latest standards Contact information For more information, please visit:

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