DA-T268-301E Ohmite

D Series Heatsink For TO-252, TO-263 and TO-268 devices Ohmite D Series heatsinks provide an innovative solution for SMT compatible semiconductors and FeatureS resistors. The unique design (Patent Pending) com- Increased sur face areas by 3 times therefore ther- bines tin plated, solderable rods with an aluminum mal per formance up to 300% over the aluminum extruded heat sink body. These rods (or rollers) stamped heat sinks on markets are mated mechanically to the heatsink by forging to reduce the thermal resistance between the heatsink Light weight aluminum construction allows faster body and the solderable feet. pick and place assembly reducing the manufactur- Specifically designed for use with the increasingly ing cycle time popular TO-252, TO-263 and TO-268 packages, the Radius mounted Rollers are designed for maxi- D Series affords the user superior thermal per for- mizing heat transfer from the component and mance over the more common stamped aluminum avoiding the thermal bottle-neck seen in stamped heatsinks. By eliminating the staking joint typically and staked heatsinks. used in stamped heatsinks, the resulting air gap and Available in tape and reel (200 or 250 based on part thermal bottle-neck is also eliminated, while sur- series) face area for cooling is maximized with the extruded fins of the D Series body. RoHS Compliant Heat DiSSipation Air Velocity (ft./min.) Air Velocity (ft./min.) 200 400 600 800 1000 200 400 600 800 1000 60 50 12 14 TO-252 (D) 55 TO-268 (D3) 10 45 TO-263 (D2) 101 & 201 12 50 301 401 40 8 45 10 101 & 201 40 35 6 301 8 401 35 4 30 6 30 25 4 25 2 2 46 8 10 2 46 8 10 Heat Dissipated (watts) Heat Dissipated (watts) Final thermal per formance is highly dependent on the thermal characteristics of the PCB. It is possible to see a 50% drop in temp rise in natural convection with a thermally improved PCB. (continued) 170 1-866-9-OHMITE Intl 1-847-258-0300 Fax 1-847-574-7522 www.ohmite.com info ohmite.com Case Temp. Rise above Ambient (C) Thermal Resistance from Mounting Surface to Ambient (C/watts) Case Temp. Rise above Ambient (C) Thermal Resistance from Mounting Surface to Ambient (C/watts)D Series Heatsink For TO-252, TO-263 and TO-268 devices DimenSionS 0.012 / 0.30mm TO-252 (D) Style 10 Style 20 TO-263 (D2) TO-268 (D3) 1.02 1.02 1.22 25.9mm 25.91mm 30.9mm 0.50 0.50 12.7mm 12.7mm 0.48 REF 0.40 10.2mm .30 0.27 12.1mm 0.26 6.9mm 6.6mm 0.09 2.3mm 0.10 0.44 (11.2mm) 0.44 TO-252 (D) 2.58mm 11.1mm 0.56 (14.2mm) TO-263 (D2) 0.56 0.67 (17mm) 14.1mm TO-268 (D3) 0.25mm 0.79 (20mm) Style 30 Style 40 TO-268 (D3) TO-263 (D2) TO-268 (D3) TO-263 (D2) 1.58 1.39 1.22 1.03 40.2mm 35.2mm 31.1mm 26.0mm 0.50 0.50 12.7mm 12.7mm 0.46 0.46 11.7mm 11.6mm 0.26 0.26 6.6mm 6.6mm 0.15 0.09 TO-268 (D3) TO-263 (D2) TO-268 (D3) TO-263 (D2) 3.7mm 2.4mm 0.44 0.67 0.67 0.44 11.2mm 11.2mm 17mm 0.2 17.0mm 0.79 0.56 0.79 0.56 20.0mm 14.2mm 20mm 0.2 14.2mm (continued) 1-866-9-OHMITE Intl 1-847-258-0300 Fax 1-847-574-7522 www.ohmite.com info ohmite.com 171