P Series Heatsinks Forged Pin Fin heatsink for TO-220, TO-247 and TO-264 devices Ohmite introduces the P series forged pin-fin heatsink (Pat. Pending). The P series heat sinks offer an all-in-one solution combin- ing a compact design with a universal cam clip system for TO-220, TO-247, TO-264 package devices. This powerful forged pin heatsink is designed to be thru-hole soldered to the PCB board. The forged pin design allows forced con- vection cooling in multiple directions. The pin fin design allows for a larger surface area creating minimum thermal flow impedance. The P series is the ideal type of heat sink for high power and small size (1U or 2U) electronic packaging with natural and forced convection cooling. SerieS SPeciFicatiONS Surface Heatsink Area Weight Length Rc-a* 2 2 Part Number Configuration (in /mm ) (oz./g) (in /mm) (C/W) PA-T2X-38E Single, 1 clip 13.4 / 8,675 0.7 / 20 1.18 / 30 7.46 PV-T2X-38E Single, 1 clip 13.4 / 8,675 0.7 / 20 1.18 / 30 8.07 PA-T21-38E Dual, 1 clip 23 / 14,823 1.3 / 39 1.18 / 30 3.13 PV-T21-38E Dual, 1 clip 23 / 14,823 1.3 / 39 1.18 / 30 3.89 PA-T22-38E Dual, 2 clip 23 / 14,823 1.3 / 39 1.18 / 30 3.13 PV-T22-38E Dual, 2 clip 23 / 14,823 1.3 / 39 1.18 / 30 3.89 *--Thermal Resistance is in open space 14 W power dissipation (28 watts for T21-T22 dual) cHaracteriSticS Heat sink AL1070 Thermal Performance Spring clip Music Wire, Per ASTM A228 with bright nickel 120 120 plating 100 100 Solder feet Brass with pure tin or nickel. RoHS compliant Single: T2X Double: T21-T22 80 80 Interface For improvement, use thermal joint compound, thermal 0.005 Grafoil (TGon 800 by Laird), or phase 60 60 resistance change material (Hi-Flow by Bergquist) 40 40 Sil-Pad 900-S, K6 800-S and K10 by Bergquist Insulator 20 20 0 0 0 6 8 10 12 16 0 12 16 20 24 28 Heat Dissipated (watts) Heat Dissipated (watts) 172 1-866-9-OHMITE Intl 1-847-258-0300 Fax 1-847-574-7522 www.ohmite.com info ohmite.com Average Case Temp. Rise above Ambient (C) Average Case Temp. Rise above Ambient (C)P Series Heatsinks Forged Pin Fin heatsink for TO-220, TO-247 and TO-264 devices dimeNSiONS Dual: T21 and T22 Single: 0.45 REF Single: T2X 2.17 (11.4mm) (51.1mm) 1.18 Dual: 0.69 1.11 (30.0mm) (17.5mm) 0.55 REF (28.2mm) (14.0mm) 1.52 1.50 1.40 (38.6mm) (38.1mm) (35.6mm) 0.65 (16.5mm) 0.10 REF Single: Dual: 1.62 (2.5mm) 0.122 0.125 (41.1mm) (3.1mm) (3.2mm) Single: Dual: Land 1.18 2.17 Pattern (30.0mm) (55.1mm) Note: For dual 0.105 pth heat sink, Device (2.67mm) holes spaced 0.69 1.11 28.2mm (17.5mm) and 0.555 14.1mm equally from center line 0.12 (3.1mm) Single: Dual: 0.71 1.62 (18.0mm) (41.1mm) OrderiNg iNFOrmatiON Package Package Standard Part Numbers TO- devices variation Part number Configuration PA-T2X-38E PA-T2X-38E Single, Anodized, 1 clip PV-T2X-38E Single, Degreased 1 clip Series Finish Height RoHS P A = anodized (mm) Compliant PA-T21-38E Dual, Anodized 1 clip V = degreased PV-T21-38E Dual, Degreased 1 clip PA-T22-38E Dual, Anodized 2 clips PV-T22-38E Dual, Degreased 2 clips rev 2/19-2 1-866-9-OHMITE Intl 1-847-258-0300 Fax 1-847-574-7522 www.ohmite.com info ohmite.com 173