RW1S0BAR005J Ohmite

General RC Carbon Composition (0.25 and 0.5 Watt) RC Ceramic Composition (0.5 Watt and above) RF Metal Film Surface Mount Standard Recessed-base RW pedestal mount mount Wirewound Power and Low Value RP Power Power Film 1 1 RM RC Series: carbon composition ( /4 & /2 watt) High Voltage Thick Film 1 Flexible RC Series: ceramic composition (above /2 watt) J-bend RF Series: metal film RW Series: wirewound RP Series: power film RM Series: high voltage thick film FeatureS Tolerance 1%, 5%, 10%, depending on construction Twelve wattage ratings Seven package sizes Two mounting designs to accommodate your soldering process Five power resistor technologies to optimize your operating perfor- mance: 1. Carbon and Ceramic composition for surge and low inductance 2. Metal film for high ohmic value and low T.C. 3. Wire element for inrush current combined with low ohmic values. Resistance values as low as 0.005 4. Power film for high ohmic value and high wattage 5. High Voltage thick film for high voltage applications Flexible J-bend terminations Working Temperature Range: -55C to +150C SerIeS SPeCIFICatIONS Power Maximum Resistance range Temp. Coefficient Dielectric Tape Size Quantity Part Number (watts)* voltage 1% tol. 5% tol. 10% tol. 0.11 110 10+ Withstanding 13 reels per reel RC0S2CA 0.25 250 2.25.6M 400 400 1000V 16mm 1500 RC0R5DB 0.50 350 2.220M 400 400 1000V 24mm 1000 RW0S6BB 0.6 50 0.0101K 0.0051K 90 50 20 1000V 12mm 2500 RF0S8BA 0.8 200 15M 100 100 1000V 12mm 2000 RW1S0BA 1.0 50 0.0051K 0.0051K 90 50 20 1000V 12mm 2000 RF1S0CA 1.0 350 101M 110M 200 100 1000V 16mm 1500 RC1R0EA 1.0 500 3.3-100K (10% tol only) -1300 1000V 32mm 750 RP1S3CA 1.25 350 11M 250 250 1000V 16mm 1500 RW1S5CA 1.5 75 0.0051.5K 0.0051.5K 90 250 250 1000V 16mm 1500 RP1S5CB 1.5 350 11M 250 250 1000V 16mm 1000 RP1R5CB RW2S0CB 2.0 100 0.0055K 0.0055K 90 50 20 1000V 16mm 1000 RW2R0CB RP2S0DA 2.0 500 11M 250 250 1000V 24mm 1000 RP2R0DA RW2S0DA 2.0 100 0.0055K 0.0055K 90 50 20 1000V 24mm 1000 RW2R0DA RP2R5DB 2.5 500 11M 250 250 1000V 24mm 1000 RW3R0DB 3.0 200 0.00513K 0.00513K 90 50 20 1000V 24mm 1000 RP3R0EA 3.0 750 11M 250 250 1000V 32mm 750 RW3R5EA 3.5 350 0.00525K 0.00525K 90 50 20 1000V 32mm 750 RM0R7EA 0.75 2500 1K1000M 1K1000M 50 1000V 32mm 750 *25C ambient. E24 values standard contact Ohmite for custom values. (continued) 32 1-866-9-OHMITE Intl 1-847-258-0300 Fax 1-847-574-7522 www.ohmite.com info ohmite.comSurface Mount Power PerFOrMaNCe data Temp. cycle Load Life Immersion Derating (-55C to 125C, (1000 hours (260C for Momentary Construction 1000 cycles) at 25C) 10 sec.) Overload 100 RC Carbon/Ceramic Comp. 4.0%+.05 10.0%+.05 3.0%+.05 6.3x rated power for 5 sec. 80 RF Metal Film 0.5%+.05 0.5%+.05 0.1%+.05 2x rated power for 0.1 sec. 60 RW Wirewound 0.5%+.05 3.0%+.05 0.1%+.05 5x rated power for 5 sec. RP Power Film 3.0%+.05 5.0%+.05 0.5%+.05 2x rated power for 0.1 sec. 40 RN Wirewound, Non-inductive 0.5%+.05 3.0%+.05 0.1%+.05 5x rated power for 5 sec. 20 ALL models: Leaching (260C Solder immersion, 60 sec.)....................... No visible leaching 0 Thermal Shock (Units at -55C, then rated power applied).. No mechanical damage 0 25 50 75 100 125 150 Flammability ......................................................................... UL Material rating, UL94V0 Ambient Temperature, C TCR Recommended Solder Profile 500 300 Soldering Preheating: 145C 15, max. 120 sec. 10 sec. 250 Soldering: min. 220C, max. 60 sec. 400 Typical TCR for 60 sec. 200 Max. Temp.: 260C 5, 10 sec. Preheating less than 0.1 SMD Cooling 120 sec. 150 resistors (PPM/C) 300 100 200 50 0 100 0 50 100 150 200 250 Time (sec.) 0.02 0.04 0.06 0.08 0.10 Ohms 200 The temperature rise graph Package limit hot spot temperature rise data was obtained by a 180 selection of test substrate Alumina size and trace width for 160 each resistor size to limit FR4 operating temperatures to 140 safe values. The operating temperature 120 safe rises are either 100C substrate temperature rise 100 or 180C package hot spot temperature rise at 25C 80 ambient. FR4: 0.062 in. thick 0.062 60 in. traces 40 Alumina: 0.040 in. thick Solder joint 0.010 in. traces 20 Molding material rated at 205C continuous. 100% 200% 300% Percent Rated power rC SerIeS: bake PrOCedure RC SERIES ONLY A. Heat Treatment B. Frequency of C. Cautions heat treatment 110C 10C Solderability: may be affected due to oxidization of lead wire 15 hours 1 time only Resistance value: some units may not completely recover to origi- nal value. Soldering heat: some treated product may have substantial resis- tance change during soldering operation. It is recommended that parts be tested to evaluate soldering heat effects. 1-866-9-OHMITE Intl 1-847-258-0300 Fax 1-847-574-7522 www.ohmite.com info ohmite.com 33 Temperature rise, C Temperature C Percent Rated Power