SMU Series SMD, single-turn, sealed cermet trimmers Available in J-hook and gull-wing terminal configurations Meets EIA, EIAJ, IPC, VECI standard SMD trimmer designs Pb-free and Cd-free construction RoHS compliant Gold-plated leads provide high conductivity, low contact resistance, high corrosion resistance and good solderability Top cross-slot adjustment (top single-slot models available as special order) Tape and reel packaging SerieS SpecificationS Manufactured Series Wattage Range () Rotation Adj. Location Taper Tolerance SMUA 0.125 50-2M 250 10 Top Linear 20% SMUB 0.25 50-2M 250 10 Top Linear 20% characteriSticS Standard Resistance 50 to 2M Low Temperature -55C, 0.125 watt, 1 hour T/R2%, Range (standard 1, 2 & 5 sequence) Operation S.S.2% Resistance Tolerance 20% standard High Temp. +125C, 250 hours T/R2%, Exposure S.S.2% End Resistance 1% or 3, whichever is greater Load Life +70C, 0.125 watt, 1,000 hours T/R3%, -55C to +125C Temp. Range S.S.2% Resistance Taper Linear Thermal Shock -55C, +125C, 30 minutes each, T/R2%, Peak Noise (C.R.V.) 2% or 3, whichever is greater 5 cycles S.S.1% Power Rating SMUA 0.125w 70C 0w +125C Shock 100G, 6ms, 6 directions, 3 times T/R1%, SMUB 0.250w 70C 0w +125C each S.S.1% Maximum Input Voltage 200VDC or power rating, whichever is Vibration 10-2,000Hz, 1.5mm amplitude, T/R1%, smaller 20G, 12 hours S.S.1% Temperature Coefficient 100ppm/C, 200 to1M Humidity +40C, 90-95%RH, 0.125 watt, T/R3%, 250ppm/C, other values 500 hours S.S.2% Insulation Resistance 100M minimum at 500VDC Moisture -10C to +65C, 80-98%RH, T/R3% Dielectric Strength 500VAC, 1 minute Resistance 0.125 watt, 10 cycles, 240 hours 250 10 Adjustment Travel 240C, 10 seconds T/R1% Soldering Heat Mechanical Travel 250 10 Resistance Shaft Torque 0 gfcm (0.69 oz in) max. Seal Test +85C, hot water for 1 minute Stop Strength 200 gfcm (2.77 oz in) min. Rotational Life 100 cycles without discontinuity, T/R5% no load Flammability of Plastic Meets UL 94V-0 Materials Nominal Weight 0.068g Position of Rotor Inside Outside Markings Resistance value or code, date code 1 3 Marking 1 3 clockwise ccw 1 3 cw 2 2 2 wiper 12 1-866-9-OHMITE Intl 1-847-258-0300 Fax 1-847-574-7522 www.ohmite.com info ohmite.comperforMance data Test Method Procedure Requirements MIL-STD-202 At +25/55C and +25/+125C Temp. Coeff. SMU Series Method 304 of Res. Life/ MIL-STD-202 At 70 2C for 1,000 hours SMCWV applied for (1%+50m) for B/D/F tol SMD, single-turn, sealed cermet trimmers Endurance Method 108A IEC 1.5 hours on and 0.5 hour off, still air required (3%+50m) for J tol 60115-1 4.25.1 characteriSticS High Temp. MIL-STD-202 1,000 hours at maximum operating temperature depending on specifica- (1%+50m) for B/D/F tol Exposure Method 108A IEC tion, unpowered. (2%+50m) for J tol (continued) 60068-2-2 Flow Soldering Profile Relow Soldering Profile Moisture MIL-STD-202 Each temperature / humidity cycle is defined at 8 hours (method 106F), (0.5%+50m) for B/ D/F tol TP 260C Max. Peak Temp. Resistance Method 106G 3 cycles / 24 hours for 10d with 25C / 65C 95% R.H, without steps 7a (2%+50m) for J tol TP 260C Max. Peak Temp. 250 TM 230C Solder Melting Temp. & 7b, unpowered. Parts mounted on test-boards, without condensation 250 TM 230C Solder Melting Temp. on parts (190C) 200 200 (180C) Humidity IEC 60115-1 4.24.2 Steady state for 1000 hours at 40C / 95% R.H. SMCWV applied for 1.5 (1%+50m) for B/D/F tol hours on and (2%+50m) for J tol (170C) 150 (140C) 150 ts. 5 sec. 0.5 hour off Solder Melting Time Pre-Heat Zone 100 100 Thermal MIL-STD-202 -55/+125C Note Number of cycles required is 300. Devices mounted (0.5%+50m) for B/D/F tol 2 min. ts. 40 sec. Shock Method 107G Maximum transfer time is 20 seconds. Dwell time is 15 minutes. Air - Air (1%+50m) for J tol 50 50 Solder Melting Time Short Time IEC 60115-1 4.13 2.5 times SMCWV or maximum overload voltage which is less for 5 sec- (1%+50m) for B/D/F tol Overload onds at room temperature (2%+50m) for J tol 1 2 3 4 1 2 3 4 Time (min.) No visible damage Time (min.) Board Flex/ IEC 60115-1 4.33 Device mounted or as described only 1 board bending required (1%+50m) for B/D/F/J Tol diMenSionS Bending bending time: 60 5 seconds 0402:5mm 0603/0805:3mm 1206 and No visible damage above:2mm (mm) Solderability J-STD-002 test B Electrical Test not required Magnification 50X SMD conditions: 1st step: Well tinned (>95% covered) 0.7 0.3 1.0 .15 3.4 0.3 Wetting method B, aging 4 hours at 155C dry heat 2nd step: leadfree solder SMUA No visible damage (t=0.15) 2 1.5 0.6 bath at 245 3C Dipping time: 3 0.5 seconds Leaching J-STD-002 test D Leadfree solder ,260C, 30 seconds immersion time No visible damage 1 0 Resistance MIL-STD-202 Condition B, no pre-heat of samples (0.5% +50m) for B/D/F tol. 3.2 0.3 3.5 0.3 2.2 0.3 1.31 0.4 to Soldering Method 210F IEC (1% +50m) for J tol. No Leadfree solder, 260C 5C, 10 1 seconds immersion time Procedure Heat 60115-1 4.18 visible damage 2 for SMD: devices fluxed and cleaned with isopropanol 3 52 0.1 0.4 0.5 3 1 0.4 1.95 +.3/-0 (2) 0.8 .15 2.25 0.3 2.0 0.3 Cross-Slot accepts both Philips and single blade adjustment tools. 5.0 0.3 0.6 .15 1.2 .15 (0.35) SMUB (t=0.18) 2 0.55 1.9 53 4.5 0.3 5.2 0.3 2.7 0.3 2.3 0.55 503 0.55 0.72 3 1 (2) 0.8 .15 (0.35) 2.3 0.3 2.5 +.3/-0 Land Pattern Flow Soldering Method Relow Soldering Method Flow or Reflow Soldering Methods 2.0 1.8 1.6 1.6 1.5 2.2 SMUA 2 2 1.0 0.9 SMUB 2 4.6 1.2 5.7 1.0 1.0 3 1 6.8 3 1 R 1.4 1.2 1.2 1 3 2.1 1.2 0.8 1.2 2.2 3.2 1.2 0.8 1.2 3.2 1.5 1.0 1.5 4.0 1-866-9-OHMITE Intl 1-847-258-0300 Fax 1-847-574-7522 www.ohmite.com info ohmite.com 13 Temperature (C) Temperature (C)