TAP1000 & 2000
1000 & 2000 Watt Heat Sinkable Planar
The TAP series delivers
1000W or 2000W of contin-
uous power when properly
mounted to a liquid cooled
heat sink (based on 85C
mounting plate tempera-
FeATures APPlicATions
ture)
High Energy Rating Power semiconductor balancing
Applications include
Low Inductance Motor control
power conditioning, power
distribution, power conver-
Resistor Element Electrically Isolated Inrush Current Limiting
sion, and power control.
High Dielectric Strength
Small Footprint
chArAcTerisTics
Resistor Element Thick Film on Alumina Rating
Test Continuous Pulse
Substrate
Rated Power, max. current and heat sink plate (TA1K0) 1000W
Power Rating 1000W or 2000W at
temperature limited
85C mounting plate (TA2K0) 2000W
Resistance Values 0.5 to 1000 Operating Voltage P*R N/A
Resistance Tolerance +10% std. Max. Applied Voltage, ohms law limited 223V 2000VDC
2000VDC 10A 53.33A
Max Operating Voltage Max. Current
Temperature Coefficient 250 PPM/C Critical Resistance; below this resistance max (TA1K0) 10
power has to be de-rated due to exceeding max
(TA2K0) 20
Dielectric Strength 6KV standard
current
Operating Temperature -55C to 85C
Range
Test Method Maximum R
Terminal Screws #10-32
1.14 x P*R / 10 sec @ 70C Max % Rsto =
Short Time
(2% + 0.05)
10 in-lb Overload
Max Contacts Torque
Moisture (TA1K0) 1000 hrs @ 40C, 90-95% RH 1%
Mounting Screws #8-32
Resistance 1%
(TA2K0) 1750 hrs @ 40C, 90-95% RH
Max Mounting Torque 15 in-lb
Thermal Shock MIL-STD-202, Method 107 MIL-STD-202,
Creepage Distance 50mm 1mm (min)
Method 107
MIL-STD-202, Method 201 2% Resistance
Vibration, elec.
Derating
Vibration, mech. MIL-STD-202, Method 201 No Loose
100
Terminal Screws
80
Load Life (TA1K0) 1000 Hrs 90 min ON / 30 min OFF 1%
1%
(TA2K0) 1750 Hrs 90 min ON / 30 min OFF
60
52F @ 2KV / 60 sec intervals, 104J, 1%
Pulse Tolerance
40
20,000 Pulses
20
Dielectric 6KVDC for 1 minute 1%
0
Strength
0 2550 85 100 125 150
Bottom of base plate Temperature, C
(continued)
144 1-866-9-OHMITE Intl 1-847-258-0300 Fax 1-847-574-7522 www.ohmite.com info@ohmite.com
Percent Rated WattsTAP1000 & 2000
1000 & 2000 Watt Heat Sinkable Planar
dimensions APPlicATion noTes
(in./mm) Proper heat sinking techniques are essential to performance of
0.193" 0.689"
a TAP resistor. Pleased follow these guidelines when designing
0.172"
(4.89mm) (17.50mm)
(4.37mm) 10-32
TAP system:
Heats sink plate (base plate of the resistor) temperature
must be monitored to establish proper de-rating. Best tech-
1.308" nique is to attach a thermocouple to the side of the base
(33.21mm)
plate of the resistor. Temperature of plastic housing or heat
sink cannot be used to establish rating of the resistor. Usage
1.622"
3.000"
of laser thermometers should be avoided.
(41.20mm)
(76.20mm)
To obtain a power rating of 1000W or 2000W, the bottom
1.308"
case temp must not exceed 85C. This can only be achieved
(33.21mm)
if the thermal conduction to the heatsink Rth-cs<0.025K/W.
This value can be reached by using thermal transfer com-
pound with a heat conductivity of 1W/mK. The flatness of
the cooling plate must be better than 0.05mm overall. The
(same dimensions)
roughness of the surface should not exceed 6.4m.
0.300"
(7.62mm)
Due to very high power density, only liquid cooled heat sinks
0.450"
are recommended for applications when >300W power rating
(11.43mm)
is desired.
0.798"
Properly designed heat sink should have more than 2 cooling
(20.26mm)
0.188"
pipes under the surface of the TAP resistor. The Ohmite CP4
(4.76mm)
heat sink (