IC Sockets XR2 OMRONs IC Connectors Have Excellent Reliability and Can Tolerate Momentary Interruptions in Power. Ideal for High- speed Data Processing. Round pins and 4-point (4-finger) contact construction ensure long life and excellent shock and vibration dura- bility. Contact entry holes are large for easy insertion. IC lead contacts placed high for solid connections. No flux rise. A wide product range: open-frame, closed-frame, sin- gle-row, carrier-type DIP terminals, wrap terminals, sol- der-sleeve terminals, and low-profile DIP terminals. A new tin-plated product series offers more choice when it comes to selecting the optimum IC Socket for an application. Conform to UL standards (file no. E 103202). RoHS Compliant Construction Contact Dimensions DIP Terminals Low-profile DIP Solder-sleeve Wrap Inner clip Terminals Terminals Terminals Base 1.83 dia. 1.83 dia. 1.83 dia. 1.83 dia. Outer sleeve 1.35 dia. 0.79 dia. Carrier 0.51 dia. Inner clip 0.635 0.635 Outer sleeve Terminology z Carrier type Carrier type refers to products where only terminals are mounted by removing the carrier after mounting on the board. z Solder sleeve type Solder sleeve type refers to products with a board mount- ing height of 0.8 mm that can be used in locations with height restrictions. 1 Ratings and Characteristics Applicable Wrap Post Wire Sizes AWG30, AWG28, AWG26, AWG24 Item Gold plated Gold flash plated (Solid wire: 0.25 to 0.51 mm dia.) Rated current 1 A Rated voltage 300 VAC Wrap Post Length Contact resistance 20 m max. (at 20 mV, 100 mA max.) 3 wires Insulation resistance 1,000 M min. (at 500 VDC) Dielectric strength 1,000 VAC for 1 min (leakage current: 1 mA Applicable IC Lead Dimensions max.) Insertion force (See 3.92 N max. DIP, Wrap, and Solder-sleeve Terminals note.) Removal force (See 0.64 N min. Depth width (mm) note.) Flat lead 0.29 0.09 0.46 0.08 (See note 1.) Insertion durability 100 times (0.75-m 20 times (gold flash gold plating), 50 times plating) Round lead 0.53 dia. max. 0.41 dia. min. (0.25-m gold plating) Ambient operating tem- Operating: 55 to 125C (with no icing) Low-profile DIP Terminals perature Depth width (mm) Note: The contact insertion force and contact removal force are for a test gauge, t = 0.432 mm. Flat lead 0.29 0.09 0.46 0.08 (See note 2.) Round lead 0.50 dia. max. 0.41 dia. min. Materials and Finish Note: 1. Do not use wire where the diagonal is more than 0.56 mm. Base Fiber-glass reinforced PBT resin (UL94V-0)/ 2. Do not use wire where the diagonal is more than 0.52 mm. black 3. IC lead length of 3 mm or more (If the lead terminal is too Carrier Aluminum long, the IC may rise up.) Inner clip Beryllium copper/nickel base, gold plated Beryllium copper/nickel base, gold flash plat- ing Outer sleeve Brass/nickel base, gold flash plating Note: For non-standard plating, contact your OMRON representative. 2 IC Sockets XR2