ECLLQFP32EVB ON Semiconductor

ECLLQFP32EVB Evaluation Board User s Manual for High Frequency LQFP32 ECLLQFP32EVB Bottom View Enlarged Bottom View Figure 2. Bottom View of the 32lead LQFP Evaluation Board LAYUP DETAIL 4 LAYER SILKSCREEN (TOP SIDE) LAYER 1 (TOP SIDE) 1 OZ ROGERS 4003 0.008 in LAYER 2 (GROUND PLANE P1) 1 OZ FR4 0.020 in 0.062 0.007 LAYER 3 (GROUND, VCC & VEE, PLANE P2) 1 OZ FR4 0.025 in LAYER 4 (BOTTOM SIDE) 1 OZ Figure 3. Evaluation Board Layup Board Layout The 32lead LQFP evaluation board was designed to be PCB board. Lists of components and simple schematics are versatile and accommodate several different configurations. located in Figures 6 through 18. Place SMA connectors on The input, output, and power pin layout of the evaluation J1 through J32, 50 chip resistors between ground pad and board is shown in Figures 4 and 5. The evaluation board has Pin 1 pad through Pin 32 pad, and chip capacitors C1 through at least thirteen possible configurable options. Table 1, list C5 according to configuration figures. (C4 and C5 are 0.01 the devices and the relevant configuration that utilizes this F and C1, C2, and C3 are 0.1 F) (See Figure 5).