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This literature is subject to all applicable copyright laws and is not for resale in any manner.FAB3103 2.3 Watt Class-D Audio Amplifier with Integrated Boost Regulator and Automatic Gain Control July 2012 FAB3103 2.3 Watt Class-D Audio Amplifier with Integrated Boost Regulator and Automatic Gain Control Features Description High Output, Low Distortion Class-D Mono The FAB3103 is a mono Class-D audio amplifier with an integrated boost regulator that achieves high output Speaker Amplifier audio over a power supply range of 2.5V to 5.2V. o 2.3W into 8 from 3.6V Supply (10% THD+N) o 1.85W into 8 from 3.6V Supply (1% THD+N) Automatic Boost Shutdown dynamically shuts down the boost regulator at low output power for greater o 0.01% THD+N into 8 (100mW) efficiency and lower quiescent current consumption. High-Efficiency Boost Regulator Provides Higher Output Power Over Li-Ion Battery Voltages Automatic Gain Control (AGC) monitors the battery and reduces gain as the battery voltage drops to limit o 85% Total Efficiency (3.6V, 8, P = 1.0W) O maximum current consumption, extending battery Adaptive Boost Shutdown at Lower Output Power runtime and preventing mobile device shutdown. Increases Efficiency and Reduces Quiescent Current Consumption: Applications o I = 2.7mA from 3.6V Supply DD Smart Phones, Feature Phones Automatic Gain Control (AGC) Monitors Battery Voltage and Dynamically Adjusts Gain, Extending Tablets, Portable Gaming Devices Battery Runtime GPS, Active Speakers Reduced Noise Floor Enhances Audio Playback o 38V Output Noise (A-Weighted) o 100dB SNR (A-Weighted) Low-EMI Design Allows Filterless Operation High-Power Supply Ripple Rejection: o 88dB PSRR (f = 217Hz, Boost Enabled) RIPPLE o 70dB PSRR (f = 217Hz, Boost Bypassed) RIPPLE High Noise Rejection Using Differential Audio Inputs: o 75dB CMRR (f = 1kHz) IN o 71dB CMRR (f = 217Hz) IN Short-Circuit Protection Under-Voltage Protection Click and Pop Suppression Available in 12-Bump, 0.5mm Pitch, WLCSP o Space-Saving 1.86mm x 1.44mm Package Figure 1. Typical Application Circuit Ordering Information Part Number Operating Temperature Range Package Packing Method 12-Bump, 0.5mm Pitch, Wafer-Level 3000 Units FAB3103UCX -40C to +85C Chip-Scale Package (WLCSP) on Tape & Reel 2011 Fairchild Semiconductor www.fairchildsemi.com FAB3103 Rev. 1.0.2