NCV8186 LDO Regulator - Fast Transient Response, Low Voltage 1 A www.onsemi.com The NCV8186x series are CMOS LDO regulators featuring 1 A output current. The input voltage is as low as 1.8 V and the output voltage can be set from 1.2 V. Features 1 Operating Input Voltage Range: 1.8 V to 5.5 V DFN8 MX SUFFIX Output Voltage Range: 1.2 to 3.9 V CASE 506AA Quiescent Current typ. 90 A Low Dropout: 100 mV typ. at 1 A, V = 3.0 V OUT PIN CONNECTIONS High Output Voltage Accuracy 1% Stable with Small 1 F Ceramic Capacitors OUT 1 8 IN Overcurrent Protection 2 7 IN OUT Builtin Soft Start Circuit to Suppress Inrush Current Thermal Shutdown Protection: 165C 3 6 N/C EN With (NCV8186A) and Without (NCV8186B) Output Discharge Function 4 5 GND FB Available in Small DFN8 2 x 2 mm Package (Top View) NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements AECQ100 Qualified and PPAP Capable MARKING DIAGRAM These Devices are PbFree, Halogen Free/BFR Free and are RoHS 1 Compliant GAM Typical Applications GA = Specific Device Code Telematics, Infotainment & Cluster, General Purpose Automotive M = Date Code Building & Factory Automation, Smart Meters, and General = PbFree Package Industrial (Note: Microdot may be in either location) VIN VOUT IN OUT CIN COUT ORDERING INFORMATION NCV8186 1 F ON 1 F See detailed ordering and shipping information in the ordering EN FB GND information section on page 9 of this data sheet. OFF Figure 1. Typical Application Schematic Semiconductor Components Industries, LLC, 2016 1 Publication Order Number: September, 2019 Rev. 4 NCV8186/DNCV8186 IN OUT IN OUT PROG. VOLTAGE PROG . VOLTAGE REFERENCE AND REFERENCE AND SOFT START SOFT START FB/ADJ FB/ADJ EN EN 0.7 V 0.7 V THERMAL THERMAL GND GND SHUTDOWN SHUTDOWN NCV8186B (without output discharge) NCV8186A (with output discharge) Figure 2. Internal Block Diagram Table 1. PIN FUNCTION DESCRIPTION Pin No. DFN8 Pin Name Description 1 OUT LDO output pin 2 3 N/C Not internally connected. This pin can be tied to the ground plane to improve thermal dissipation. 4 FB Feedback input pin 5 GND Ground pin 6 EN Chip enable input pin (active H) 7 IN Power supply input pin 8 EPAD EPAD Its recommended to connect the EPAD to GND, but leaving it open is also acceptable Table 2. ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage (Note 1) IN 0.3 to 6.0 V Output Voltage OUT 0.3 to V + 0.3 V IN Chip Enable Input EN 0.3 to 6.0 V Output Current I Internally Limited mA OUT Maximum Junction Temperature T 125 C J(MAX) Storage Temperature T 55 to 150 C STG ESD Capability, Human Body Model (Note 2) ESD 2000 V HBM ESD Capability, Machine Model (Note 2) ESD 200 V MM Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AECQ100002 (EIA/JESD22A114) ESD Machine Model tested per AECQ100003 (EIA/JESD22A115) Latchup Current Maximum Rating tested per JEDEC standard: JESD78 Table 3. THERMAL CHARACTERISTICS Rating Symbol Value Unit Thermal Resistance, JunctiontoAir, DFN8 2 mm x 2 mm (Note 3) R 93 C/W JA 3. Measured according to JEDEC board specification. Detailed description of the board can be found in JESD51 7. www.onsemi.com 2