For board-to-FPC High Current Connectors B01 Achieved high current capacity (6A) and high reliability with low prole of 0.6 mm/0.8 mm FEATURES 1. High current rating: 6A (3A/pin 4 pins) 2. High removal force while miniature and low prole APPLICATIONS Smartphones, tablet PCs and other mobile devices DETAILED FEATURES High current rating: 6A (3A/pin 4 pins) Achieved small size and space saving. ORDERING INFORMATION ACCTB71E 201803-T 1High current connectors B01 PRODUCT TYPES Part number Packing Mated height Number of contacts Socket Header Inner carton (1-reel) Outer carton 0.6mm 6 AXF361500 AXF461500 15,000 pieces 30,000 pieces 0.8mm 6 AXF363500 AXF463500 Notes: 1. Order unit: For volume production: 1-inner carton (1-reel) units. For samples, please contact our sales ofce. 2. Please contact our sales ofce for connectors having a number of pins other than those listed above. SPECIFICATIONS 1. Characteristics Item Specications Conditions Power contact 3.0 A/pin contact Rated current Signal contact 0.3 A/pin contact Rated voltage 30V AC/DC Electrical No short-circuiting or damage at a detection current of 1 mA Dielectric strength 150V AC for 1 minute characteristics when the specied voltage is applied for one minute. Insulation resistance Min. 1,000M (initial) Using 250V DC megger (applied for 1 minute) Max. 20m (power terminal) According to the contact resistance measurement method of Contact resistance Max. 90m (signal terminal) JIS C 5402 Composite insertion force Max. 40 N Mechanical characteristics Composite removal force Min. 10 N (H: 0.6, initial) Ambient temperature 55 to +85C No icing. No condensation. Reow soldering: Peak temperature: 260C or less The initial specication must be satised electrically Soldering heat resistance (on the surface of the PC board around the connector and mechanically terminals) Soldering iron: 300C within 5 sec. 350C within 3 sec. 55 to +85C (products only) Storage temperature No icing. No condensation. 40 to +50C (emboss packing) Conformed to MIL-STD-202F, method 107G Order Temperature (C) Time (minutes) 5 cycles, 0 1 553 30 Thermal shock resistance insulation resistance min. 100M, 2 Max. 5 (Header and socket mated) contact resistance max. 20m (power terminal) +3 Environmental 3 85 0 30 max. 90m (signal terminal) characteristics 4 Max. 5 0 553 120 hours, Humidity resistance insulation resistance min. 100M, Conformed to IEC60068-2-78 (Header and socket mated) contact resistance max. 20m (power terminal) Temperature 402C, humidity 90 to 95% R.H. max. 90m (signal terminal) 24 hours, Salt water spray resistance insulation resistance min. 100M, Conformed to IEC60068-2-11 (Header and socket mated) contact resistance max. 20m (power terminal) Temperature 352C, salt water concentration 51% max. 90m (signal terminal) 48 hours, Conformed to JEIDA-38-1984 H2S resistance contact resistance max. 20m (power terminal) Temperature 402C, gas concentration 31 ppm, (Header and socket mated) max. 90m (signal terminal) humidity 75 to 80% R.H. Mechanical life 30 times Lifetime Contact resistance max. 20m (power terminal) Repeated insertion and removal cycles of max. 200 times/ Insertion and removal life characteristics max. 90m (signal terminal) hour Composite removal force min. 7 N 6 pins Socket h = 0.6 mm: 0.010g, h = 0.8 mm: 0.013g Unit weight 6 pins Header h = 0.6 mm: 0.004g, h = 0.8 mm: 0.005g 2. Material and surface treatment Part name Material Surface treatment Molded portion LCP resin (UL94V-0) Contact portion: Base: Ni plating, Surface: Au plating Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips) Contact and Post Copper alloy The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions). Sockets: Base: Ni plating, Surface: Pd + Au ash plating (except the terminal tips) Soldering terminals Copper alloy Headers: Base: Ni plating, Surface: Au plating (except the terminal tips) ACCTB71E 201803-T 2