For board-to-FPC High Current Connectors B02 Low 0.7 mm prole, high current capacity (10A), 4 signal pins FEATURES 1. High current rating: 10A (5A/pin 4 pins) 2. 4 signal pin type for wide range of control applications 3. High removal force while miniature and low prole APPLICATIONS Smartphones, tablet PCs and other mobile devices DETAILED FEATURES High current rating: 10A (5A/pin 4 pins) Miniature design provides space-saving benets. ORDERING INFORMATION ACCTB95E 201803-T 1 High current connectors B02 PRODUCT TYPES Part number Packing Mated height Number of contacts Socket Header Inner carton (1-reel) Outer carton 0.7mm 8 AXF382700 AXF482700 15,000 pieces 30,000 pieces Notes: 1. Order unit: For volume production: 1-inner carton (1-reel) units. For samples, please contact our sales ofce. 2. Please contact our sales ofce for connectors having a number of pins other than those listed above. SPECIFICATIONS 1. Characteristics Item Specications Conditions Power contact 5.0A/pin contact Rated current Signal contact 0.3A/pin contact Rated voltage 30V AC/DC Electrical No short-circuiting or damage at a detection current of 1 mA Dielectric strength 150V AC for 1 minute characteristics when the specied voltage is applied for one minute. Insulation resistance Min. 1,000M (initial) Using 250V DC megger (applied for 1 minute) Max. 16m (power terminal) According to the contact resistance measurement method of Contact resistance Max. 90m (signal terminal) JIS C 5402 Composite insertion force Max. 40 N Mechanical characteristics Composite removal force Min. 10 N (initial) Ambient temperature 55 to +85C No icing. No condensation. Reow soldering: Peak temperature: 260C or less The initial specication must be satised electrically Soldering heat resistance (on the surface of the PC board around the connector and mechanically terminals) Soldering iron: 300C within 5 sec. 350C within 3 sec. 55 to +85C (products only) Storage temperature No icing. No condensation. 40 to +50C (emboss packing) Conformed to MIL-STD-202F, method 107G Order Temperature (C) Time (minutes) 5 cycles, 0 1 55 30 3 Thermal shock resistance insulation resistance Min. 100M, 2 Max. 5 (Header and socket mated) contact resistance max. 16m (power terminal) +3 3 85 30 0 Environmental max. 90m (signal terminal) 4 Max. 5 characteristics 0 55 3 120 hours Conformed to IEC60068-2-78 Humidity resistance insulation resistance Min. 100M, Temperature 402C, (Header and socket mated) contact resistance max. 16m (power terminal) humidity 90 to 95% R.H. max. 90m (signal terminal) 24 hours Conformed to IEC60068-2-11 Salt water spray resistance insulation resistance Min. 100M, Temperature 352C, (Header and socket mated) contact resistance max. 16m (power terminal) salt water concentration 51% max. 90m (signal terminal) Conformed to JEIDA-38-1984 48 hours H2S resistance Temperature 402C, contact resistance Max. 16m (power terminal) (Header and socket mated) gas concentration 31 ppm, Max. 90m (signal terminal) humidity 75 to 80% R.H. Mechanical life 30 times Lifetime Contact resistance Max. 16m (power terminal) Repeated insertion and removal cycles of max. 200 times/ Insertion and removal life characteristics Max. 90m (signal terminal) hour Composite removal force Min. 7 N 8 pins Socket: 0.012 g Unit weight 8 pins Header: 0.005 g 2. Material and surface treatment Part name Material Surface treatment Molded portion LCP resin (UL94V-0) Contact portion: Base: Ni plating, Surface: Au plating Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips) Contact and Post Copper alloy The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions). Sockets: Base: Ni plating, Surface: Pd + Au ash plating (except the terminal tips) Soldering terminals Copper alloy Headers: Base: Ni plating, Surface: Au plating (except the terminal tips) ACCTB95E 201803-T 2