X-On Electronics has gained recognition as a prominent supplier of ENW89819AZKF Bluetooth Development Tools - 802.15.1 across the USA, India, Europe, Australia, and various other global locations. ENW89819AZKF Bluetooth Development Tools - 802.15.1 are a product manufactured by Panasonic. We provide cost-effective solutions for Bluetooth Development Tools - 802.15.1, ensuring timely deliveries around the world.

ENW89819AZKF Panasonic

ENW89819AZKF electronic component of Panasonic
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Part No.ENW89819AZKF
Manufacturer: Panasonic
Category: Bluetooth Development Tools - 802.15.1
Description: Bluetooth Development Tools (802.15.1) PAN1323 Dev Module Bluetooth / 802.15.1
Datasheet: ENW89819AZKF Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 66.1238 ea
Line Total: USD 66.12 
Availability - 1
Ship by Mon. 30 Dec to Fri. 03 Jan
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
1
Ship by Mon. 30 Dec to Fri. 03 Jan
MOQ : 1
Multiples : 1
1 : USD 66.1238
5 : USD 58.9969
10 : USD 57.2512
30 : USD 54.7837
50 : USD 52.5262
100 : USD 51.135
250 : USD 50.3606

   
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We are delighted to provide the ENW89819AZKF from our Bluetooth Development Tools - 802.15.1 category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the ENW89819AZKF and other electronic components in the Bluetooth Development Tools - 802.15.1 category and beyond.

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No. REV. CLASSIFICATION PRODUCT SPECIFICATION DS-13xx-2400-102 5.1 SUBJECT CLASS 1 or 2 BLUETOOTH MODULE PAGE 1 of 55 CUSTOMERS CODE PANASONICS CODE DATE 08.11.2017 PAN13XX Core Specification See Chapter Ordering Information Product Specification Manufacturer Panasonic Industrial Devices Europe GmbH Zeppelinstrasse 19 21337 Lneburg Germany By purchase of any of the products described in this document the customer accepts the document's validity and declares their agreement and understanding of its contents and recommendations. Panasonic reserves the right to make changes as required at any time without notification. Please consult the most recently issued Product Specification before initiating or completing a design. Panasonic Industrial Devices Europe GmbH 2017. All rights reserved. This Product Specification does not lodge the claim to be complete and free of mistakes. APPROVED CHECKED DESIGNED Power Electronics R&D Center Wireless Connectivity Panasonic Industrial Devices Europe GmbH No. REV. CLASSIFICATION PRODUCT SPECIFICATION DS-13xx-2400-102 5.1 SUBJECT CLASS 1 or 2 BLUETOOTH MODULE PAGE 2 of 55 CUSTOMERS CODE PANASONICS CODE DATE 08.11.2017 PAN13XX Core Specification See Chapter Ordering Information TABLE OF CONTENTS 1 About this document....................................................................................................................... 4 1.1 Purpose .............................................................................................................................................. 4 1.2 Revision History ................................................................................................................................. 4 1.3 Related Documents ........................................................................................................................... 5 1.4 General Information ........................................................................................................................... 5 1.5 Contact Us ......................................................................................................................................... 6 2 New PAN13x5B, PAN13x6B .......................................................................................................... 7 3 Key Features .................................................................................................................................. 8 4 Applications for the Module ............................................................................................................ 8 5 Description for the Module ............................................................................................................. 9 6 Detailed Description .....................................................................................................................10 6.1 Terminal Layout ............................................................................................................................... 10 6.2 Pin Description ................................................................................................................................. 11 6.3 Device Power Supply ....................................................................................................................... 12 6.4 Clock Inputs ..................................................................................................................................... 14 7 Bluetooth Features .......................................................................................................................14 8 Block Diagram ..............................................................................................................................15 9 Test Conditions ............................................................................................................................16 10 General Device Requirements and Operation .............................................................................16 10.1 Absolute Maximum Ratings ............................................................................................................. 16 10.2 Recommended Operating Conditions .............................................................................................. 17 10.3 Current Consumption ....................................................................................................................... 17 10.4 General Electrical Characteristics .................................................................................................... 18 10.5 nSHUTD Requirements ................................................................................................................... 18 10.6 External Digital Slow Clock Requirements ....................................................................................... 18 11 Host Controller Interface ..............................................................................................................19 12 Audio/Voice Codec Interface ........................................................................................................20 12.1 PCM Hardware Interface .................................................................................................................. 20 12.2 Data Format ..................................................................................................................................... 20 12.3 Frame Idle Period ............................................................................................................................ 21 12.4 Clock-Edge Operation ...................................................................................................................... 21 12.5 Two-Channel PCM Bus Example ..................................................................................................... 22 12.6 Audio Encoding ................................................................................................................................ 22 12.7 Improved Algorithm For Lost Packets .............................................................................................. 22 12.8 Bluetooth/PCM Clock Mismatch Handling........................................................................................ 23 12.9 Bluetooth Inter-IC Sound (I2S) ......................................................................................................... 23 12.10 Current Consumption for Different Bluetooth Scenarios .................................................................. 23 13 Bluetooth RF Performance ...........................................................................................................24 14 Soldering Temperature-Time Profile (for reflow soldering) ..........................................................27 14.1 For leadfree solder ........................................................................................................................... 27 15 Module Dimension ........................................................................................................................28 15.1 Module Dimensions PAN131X without Antenna .............................................................................. 28 15.2 Module Dimensions PAN132X with Antenna ................................................................................... 29 16 Footprint of the Module ................................................................................................................30 PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de

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