EVP-AEDB2A Panasonic

Light Touch Switches/EVPAE 4.5 mm 2.2 mm Side-operational Edge Mount Light Touch Switches Type: EVPAE Features External dimensions : 4.5 mm 2.25 mm (Excluding the push plate), Height 2.9 mm (Printed circuit board being as low as 0.95 mm) Improved soldering strength in the operating direction Long operational life Measure against electro static discharge(ESD) Recommended Ap pli ca tions Operation switches for portable electronic equipment (Mobile phones, Digital still cameras, Camcorders Portable audio players, etc.) Explanation of Part Numbers 1 2 3 4 5 6 7 8 9 E V P AE Product Code Type Height Speci cations Type Snap action / Push-on type SPST Rating 10 A 2 Vdc to 20 mA 15 Vdc (Resistive load) Con tact Resistance 1000 m max. Ele ctrical Insula tion Resistance 100 M min. (at 100 Vdc) Di electric Withst and ing Voltage 250 Vac (1 minute) Bo uncing 10 ms max. (ON, OFF) Op erating Force 1.6 N Mechanical Push Travel 0.15 mm Push Strength 50 N (1 minute) EnduranceOperating Life 200000 cycles min. Operating Temperature 40 C to +85 C 40 C to +85 C (Bulk) Storage Temper a ture 20 C to +60 C (Taping) Minimum Quantity/Packing Unit 3500 pcs. Embossed Taping (Reel Pack) Quantity/Carton 17500 pcs. Design and speci cations are each subject to change without notice. Ask factory for the current technical speci cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 00 Sep. 2010 ES107 Light Touch Switches/EVPAE Dimensions in mm (not to scale) EVPAE Circuit Diagram 4.5 2.2 3.3 3.10.1 +0.08 Dimensions for reference 3.6 0.1 1.50.1 +0.2 0.80.1 R0.3 max. 4.8 0 2 1 1 R0.3 to R0.5 2-0.25 max. (0.2tpy) 2-0.25 max. +0.1 3.8 0 2-0.60.1 5.60.1 Note : Please put your consideration 0.60.1 not to let any burrs of printed Push plate side wiring board stick out from (2.3) the mounting surface of our switches. PWB land pattern for reference Height from surface of PCB : 0.95 mm Recommended Re ow Soldering Conditions Embossed Carrier Tap ing MAX. 260 Fan or Normal Temp. Tape width=12.0 mm 230 t Feeding hole 1 Chip pocket 180 P P D 2 0 0 150 A P Tape running direction Chip component 1 (Normal Temp.) t 2 9030 4010 Soldering Time (s) Unit: mm 1 2 0 0 Dia 1 2 Part No. Height A B W F E P P P D t t +0.1 EVPAE 2.9 5.50.2 2.90.2 12.00.3 5.50.1 1.750.10 8.00.1 2.00.1 4.00.1 1.5 0 0.30.1 3.30.20 Standard Reel Dimensions in mm (not to scale) T E Item A B C D E C Rate (mm) 380.02.0 80.01.0 13.00.5 21.01.0 2.00.5 Item W T t r D r Rate (mm) 13.51.0 17.51.0 A W t Design and speci cations are each subject to change without notice. Ask factory for the current technical speci cations before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. 00 Sep. 2010 ES108 Operation Top (C) +0.2 2.6 0.1 +0.2 1.5 0.1 1.7 B 2.9 2.2 1.650.1 0.4 max. (0.3tpy) +00.5 0.55 0.95 0.10 10.1 0.30.1 B 1.350.1 +00.8 0 0.05 +00.7 0.08 0 0.4 max. (0.3tpy) F E W