Light Touch Switches/EVPBL 2.8 mm1.9 mm SMD Light Touch Switches Type: EVPBL Features External dimensions: 2.8 mm1.9 mm, Height 0.53 mm, 0.57 mm High operability equipped with an actuator (push plate) IP67 Recommended Applications Operation switches for portable electronic equipments (Mobile phone, Portable audio) Explanation of Part Numbers(Standard specification only) 1 2 3 4 567 8 9 10 11 12 BL A0B 00 Product Code Type Operating Height Force Speci cations Type Snap action/Push-on type SPST Rating 10 A 2 V DC to 20 mA 15 V DC (Resistive load) Contact Resistance 500 m max. Electrical Insulation Resistance 50 M min. (at 100 V DC) Dielectric With standing Voltage 250 V AC for 1 minute Bouncing 10 ms max. (ON, OFF) Operating Force 1.6 N, 2.25 N Mechanical Travel 0.15 mm Endurance Operating Life 300,000 cycles min. Dust resistance : 4 types of talc 8 h, Protective Structure IP67( 1) Water resistance : Immersion depth 1 m 30 min. Operating Temperature 40 C to +85 C 40 C to +85 C (Bulk) Storage Temperature 20 C to +60 C (Taping) Minimum Quantity/Packing Unit 16,000 pcs. Embossed Taping (Reel Pack) Quantity/Carton 80,000 pcs. Note: Non washable ( 1) IP67 : Switch shall not be operated during test. Water or dust ingress shall be limited enough to prevent deleterious effect to the switch function. However, IP67 shall be guaranteed under single product state, then there is a possibility that IP67 performance become impaired depending on your mounting condition or usage. So, please ask us in advance, if the switch is applied to important usage for water and dust resistant. LQGXVWULDO SDQDVRQLF FRP DF H 1 Light Touch Switches/EVPBL Dimensions in mm (not to scale) EVPBL (Embossed Taping) General dimension tolerance : 0.1 dimensions are reference dimensions. This reference specifications are subject to change. (Terminal) Circuit Diagram Molding gate This product is designed to be smaller than the conventional type, which lowered the film peel off strength. Therefore please avoid to apply force to a push plate from side, or/and avoid set-knob to touch push plate during insertion to a set-case. :Recommended land pattern area. :No soldering area. Solder thickness t=0.080.01 Any land pattern or via holes shall not be provided at area. If it s necessary to design land pattern or via holes at area. No soldering please apply resist to them to protect their metal part completely. If their metal parts are not protected completely,short circuit failure may occur by solder ball. Beside, there should be convexoconcave by designing additional pattern, it may cause swith tilt, influence on solder-ability or flux intrusion after reflow soldering. Therefore, please study any influence of additional land pattern or via holes at area in advance. Part Numbers Operating Force H=Height Operating Life EVPBL2A1B000 1.6 N 0.53 mm 300,000 cycles EVPBL9A2B000 2.25 N 0.57 mm 300,000 cycles 2 (Without the remainder of the molding gate and the film)