Spec. No.
Subject
151-EXB-28N03DE
Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION
Part No.
EXB28N
8-1
1. Dimension
A1 A2
(2)Protective (3)Resistive
a
(1)Substrate
coating element
Alumina Resin Ruthenium oxide
(4)Termination (5)Termination (6) Termination
(Inner) (Between) (Outer)
Ag or Ag/Pd
Ni Plating Sn Plating
Side:Resin+Metal
a
P
T
L
a-a sectional plan
(1) (2) (3) (4) (5) (6)
L W T A1 A2
Dimension(mm) 2.00 0.10 1.00 0.10 0.35 0.10 0.45 0.10 0.35 0.10
( ) : Reference
B P G
Dimension(mm) 0.20 0.10 (0.50) 0.25 0.10
2. Power derating curve
100
-55 C 70C
80
Category temperature range
60
40
-55 C to +125C
20
125C
0
-60 -40 -20 20 40 60 80 100 120
140 160
0
Ambient Temperature( C)
Fig. 1
3. Ratings
Item Rated Value Explanation
When used at ambient temperature over 70 C,
0.063 W / element the rated dissipation should be reduced as
Rated Dissipation
shown in Fig.1
Chip jumper : Rated current 1 A (Resistance is less than 50 m)
The rated voltage of each resistor should be calculated from the
Rated voltage
equation below, and when the rated voltage exceeds the limiting
&
element voltage, the limiting element voltage should the maximum
Rated Continuous
working voltage.
Working Voltage
E = P R Limiting element voltage : 50 V
(RCWV)
E: Rated voltage(V), P: Rated dissipation(W), R: Rated resistance())
Panasonic Electronic Devices Co., Ltd.
% of rated dissipation
G G
B
B
W Spec. No.
Subject
151-EXB-28N03DE
Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION
Part No.
EXB28N
8-2
Item Rated Value Explanation
Sign Tolerance for resistance
Resistance
J 5%
tolerance
0 Chip Jumper
Range of rated Tolerance Resistance range Series
resistance for J 10 to 1.0 M E-24
manufacture
0 Less than50 m -
4. Explanation of part number
E X B 2 8 N 1 0 2 J X
Thick Film Rated Resistance Tolerance
Resistor Networks
Taping
Chip Resistor Array
R 0 0 0
Part No. 28N
Chip Jumper
87 65
Circuit
Packaging Code
Taping
X
12 34
(10,000pcs/reel)
5. Appearance & Construction
Item Specifications Explanation
1. The resistive element should be covered with protective coating
that do not fade easily. The surface of coating should avoid
unevenness, flaw, pinhole and discoloration.
2. The electrode should be printed uniformly, as shown in the
Appearance & dimensions. The plating should not fade easily, and should avoid
Construction unevenness, flaw, pinhole, projection and discoloration.
3. The electrode should be connected electrically, mechanically to
resistive element.
4. Substrate should not have chipping, flaw, flash and crack. Details
of appearance criteria shall be as described in attached sheet
As far as there shall be not designation especially, the following test and measurement shall be
operated under normal temperature(15 C to 35 C), normal humidity(25 %RH to 75 %RH),
normal atmospheric pressure(86 kPa to 106 kPa).
Panasonic Electronic Devices Co., Ltd.