LNJ353W83RA Panasonic

LNJ353W83RA Hight Bright Surface Mounting Chip LED SV (Side View) -0.5 Type Absolute Maximum Ratings T = 25C a Lighting Color Parameter Symbol Rating Unit Yellow Green Power dissipation P 55 mW D Forward current I 20 mA F * Pulse forward current I 60 mA FP Reverse voltage V 4 V R Operating ambient temperature T 30 to +85 C opr Storage temperature T 40 to +100 C stg Note) : The condition of I is duty 10%, Pulse width 1 msec. * FP Electro-Optical Characteristics T = 25C3C a Parameter Symbol Conditions Min Typ Max Unit 1 * Luminous intensity I I = 5 mA 4.0 8.5 33.4 mcd O F Reverse current I V = 4 V 100 A R R Forward voltage V I = 5 mA 1.95 2.30 V F F Peak emission wavelength I = 5 mA 575 nm P F 2 * Dominant emission wavelength I = 5 mA 566 572 578 nm d F Spectral half band width I = 5 mA 20 nm F Note) 1: Measurement tolerance: 20% * 2: Measurement tolerance: 3 nm * I I I V Relative luminous intensity T O F F F a 3 3 2 10 10 10 2 10 2 10 10 10 1 1 10 2 11010 1.6 1.8 2.0 2.2 2.4 20 0 20 40 80 100 60 Forward current I (mA) Forward voltage V (V) Ambient temperature T (C) F F a Relative luminous intensity I T P F a 30 100 Directive characteristics 80 0 20 10 10 20 20 30 30 60 40 40 80 50 50 60 40 60 60 10 40 70 70 20 20 80 80 90 90 0 0 500 550 600 650 100 80 60 40 20 0 20 40 60 80 100 0 20 40 60 80 100 Peak emission wavelength (nm) Relative luminous intensity (%) Ambient temperature T (C) P a Publication date: November 2016 Ver. DEK 1 Luminous intensity I (mcd) Relative luminous intensity (%) O Forward current I (mA) F Forward current I (mA) Relative luminous intensity (%) FLNJ353W83RA Package (Unit: mm) 1.80 0.15 1.3 0.1 1 2 1.2 0.1 0.28 0.1 0.28 0.1 2 1 0.20 0.1 0.20 0.1 /Polarity /Recommended Land Layout 2.6 2 1 1:Anode 2:Cathode 0.55 0.21 /Notes 1. Measurement of the package doesnt include electrode projection. 2. Precaution to soldering Assembly conditions such like mechanical lode in placing LED and also suitable volume and type of solder paste has to be fully investigated. Insufficient soldering may occur because of the condition of solder terminal surface which is caused is caused by its unique production process. 3. LED (L) Please do not print silk more than fixture foot pattern thickness (L) basically within the range right under the LED. Ver. DEK 2 1.18 0.5 0.1 0.68 0.1 1.1 0.1 0.48 0.35 L