PRELIMINARY Data Sheet No. PD60256 revA
IRS2130D/IRS21303D/IRS2132D
3-PHASE BRIDGE DRIVER
Product Summary
Features
Floating channel designed for bootstrap operation
V 600 V max.
OFFSET
Fully operational to +600 V
Tolerant to negative transient voltage, dV/dt immune I +/- (min.) 200 mA / 420 mA
O
Gate drive supply range from 10 V to 20 V
V 10 V 20 V (IRS213(0,2)D)
OUT
Undervoltage lockout for all channels
13 V 20 V (IRS21303D)
Over-current shutdown turns off all six drivers
t (typ.) 500 ns
on/off
Three Independent half-bridge drivers
Matched propagation delay for all channels
Deadtime (typ.) 2.0 s (IRS2130D)
2.5 V logic compatible
0.7 s (IRS213(2,03)D)
Outputs out of phase with inputs
Cross-conduction prevention logic
Applications:
All parts are LEAD-FREE
*Motor Control
Integrated bootstrap diode function
*Air Conditioners/ Washing Machines
*General Purpose Inverters
*Micro/Mini Inverter Drives
Description Packages
The IRS213(0, 03, 2)D are high voltage, high speed
power MOSFET and IGBT drivers with three independent
high and low side referenced output channels. Proprietary
HVIC technology enables ruggedized monolithic
construction. Logic inputs are compatible with CMOS or
LSTTL outputs, down to 2.5 V logic. A ground-referenced
operational amplifier provides analog feedback of bridge
28-Lead SOIC 28-Lead PDIP
current via an external current sense resistor. A current trip
function which terminates all six outputs is also derived from
this resistor. An open drain FAULT signal indicates if an
over-current or undervoltage shutdown has occurred. The
output drivers feature a high pulse current buffer stage
designed for minimum driver cross-conduction. Propagation
delays are matched to simplify use at high frequencies. The
44-Lead PLCC w/o 12 Leads
floating channels can be used to drive N-channel power
MOSFETs or IGBTs in the high side configuration which operates up to 600 V.
Typical Connection
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PRELIMINARY
Absolute Maximum Ratings
Absolute Maximum Ratings indicate sustained limits beyond which damage to the device may occur. All voltage
parameters are absolute voltages referenced to V . The thermal resistance and power dissipation ratings are
SO
measured under board mounted and still air conditions. Zener clamps are included between V & V (25 V), V &
CC SO CC
V (20V), and V & V (20 V).
SS Bx Sx
Symbol Definition Min. Max. Units
V High side floating supply voltage -0.3 625
B1,2,3
V High side floating offset voltage V - 20 V + 0.3
S1,2,3 B1,2,3 B1,2,3
V High side floating output voltage V - 0.3 V + 0.3
HO1,2,3 S1,2,3 B1,2,3
V Low side and logic fixed supply voltage -0.3 25
CC
V Logic ground V - 20 V + 0.3
SS CC CC
V Low side output voltage -0.3 V + 0.3
LO1,2,3 CC
V
(V + 15) or
SS
Logic input voltage ( HIN1,2,3, LIN1,2,3 & ITRIP) (V + 0.3),
CC
V V -0.3
IN SS
whichever is
lower
V FAULT output voltage V -0.3 V +0.3
FLT SS CC
V Operational amplifier output voltage V -0.3 V +0.3
CAO SS CC
V Operational amplifier inverting input voltage V -0.3 V +0.3
CA- SS CC
dV /dt Allowable offset supply voltage transient 50 V/ns
S
(28 lead PDIP) 1.5
P Package power dissipation @ T +25 C W
D A (28 lead SOIC) 1.6
(44 lead PLCC) 2.0
(28 lead PDIP) 83
R Thermal resistance, junction to ambient C/W
th,JA (28 lead SOIC) 78
(44 lead PLCC) 63
T Junction temperature 150
J
T Storage temperature -55 150 C
S
T Lead temperature (soldering, 10 seconds) 300
L
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