BAT54TW / ADW / CDW / SDW / DW / BRW / TWP SURFACE MOUNT SCHOTTKY DIODE ARRAYS POWER 225mWatt 30 Volt VOLTAGE FEATURES Isolated diode arrays for significant board space savings Surface mount package ideally suited for automatic insertion Extremely Fast Switching Speed Very Low V : 0.347V (Typ) at I = 10mA F F Lead free in compliance with EU RoHS2.0 Green molding compound as per IEC 61249 standard MECHANICAL DATA Case: SOT-363 plastic Terminals: Solderable per MIL-STD-750, Method 2026 Approx. Weight: 0.0002 ounces, 0.006 grams ABSOLUTE RATINGS (each diode) Parameter Symbol BAT54TW BAT54ADW BAT54CDW BAT54SDW BAT54DW BAT54BRW BAT54TWP Units Maximum Reverse Voltage VR 30 V Peak Reverse Voltage VRRM 30 V Continuous Forward Current I F 0.2 A Peak Forward Surge Current:8.3ms single half sine-wave superimposed I FSM 1 A on rated load per diode Circuit Figure - Fig 50 Fig 46 Fig 47 Fig 45 Fig 107 Fig 65 Fig 49 - THERMAL CHARACTERISTICS Parameter Symbol Value Units Power Dissipation (Note 1) PTOT 225 mW O Typical Thermal Resistance, Junction to Ambient (Note 1) RJA 550 C/W O Typical Thermal Resistance, Junction to Lead (Note 2) RJL 220 C/W O Junction Temperature Range TJ -55 to 125 C O Storage Temperature Range TSTG -55 to 150 C NOTE:1.FR-4 Board Minimum pad. 2 2.Mounted on a FR4 PCB, single-sided copper, with 100cm copper pad area 9 February 6,2018-REV.09 PAGE . 1BAT54TW / ADW / CDW / SDW / DW / BRW / TWP O ELECTRICAL CHARACTERISTICS (each diode) (TA=25 C, unless otherwise noted) Parameter Symbol Test Condition MIN. TYP. MAX. Units Reverse Breakdown Voltage V(BR) I R=100A30--V Reverse Current I R VR=25 V--2 A I F=0.1mA - - 0.24 I F=1mA - - 0.32 Forward Voltage VF I F=10mA - - 0.4 V I F=30mA - - 0.5 I F=100mA - - 0.6 Total Capacitance CT VR=1V, f=1MHZ - - 10 pF TYPICAL CHARACTERISTIC CURVES Fig.1 Operating Temperature Derating Curve Fig.2 Typical Junction Capacitance Fig.3 Typical Reverse Characteristics Fig.4 Typical Forward Characteristics February 6,2018-REV.09 PAGE . 2