PA4341.821ANLT Pulse

SMT Power Inductors High Current Molded Power Inductor - PA4341.XXXANLT Series Height: 3.0mm Max Footprint: 7.4mm x 6.8mm Max Current Rating: up to 30.0A Inductance Range: 0.15uH to 22.0uH Shielded construction and compact design High current, low DCR, and high efficiency Minimized acoustic noise and minimized leakage flux Electrical Specifications 25C - Operating Temperature -55C to +155C DC Resistance 5 Inductance Rated Saturation 100KHz, 1V Current TYP. MAX. Current Part Number uH20% A m m A PA4341.151ANLT 0.15* 30 1.7 2.1 40 PA4341.221ANLT 0.22 23 2.0 2.5 34 PA4341.331ANLT 0.33 21 2.8 3.4 25 PA4341.361ANLT 0.36 20 3.3 3.9 24 PA4341.471ANLT 0.47 18 3.4 4 20 PA4341.561ANLT 0.56 16.5 3.9 4.5 18 PA4341.681ANLT 0.68 16 4.7 5.3 17 PA4341.821ANLT 0.82 14 5.4 6 16 PA4341.102ANLT 1.0 12 6.7 7.4 15 PA4341.122ANLT 1.2 10 7.7 9.5 14 PA4341.152ANLT 1.5 10 10.2 12.1 14 PA4341.222ANLT 2.2 8 13.5 15 10 PA4341.272ANLT 2.7 7.2 17.3 20 9.8 PA4341.332ANLT 3.3 6.5 19 22 9.5 PA4341.472ANLT 4.7 5.5 28 33 6.5 PA4341.562ANLT 5.6 5.5 39 42 6 PA4341.682ANLT 6.8 4.5 43 50 6 PA4341.822ANLT 8.2 4.5 54 60 6 PA4341.103ANLT 10 4 62 68 5.5 PA4341.153ANLT 15 3 110 140 4.5 PA4341.223ANLT 22 2.5 150 190 3 1 power.pulseelectronics.com P820. D (07/18) 0 SMT Power Inductors High Current Molded Power Inductor - PA4341.XXXANLT Series Notes: 1. Actual temperature of the component during system operation (ambient plus 4. The part temperature (ambient+temp rise) should not exceed 155C under worst temperature rise) must be within the standard operating range. case operating conditions. Circuit design, PCB trace size and thickness, airflow and 2. The saturation current is the current at which the initial inductance drops approxi- other cooling provisions all affect the part temperature. Part temperature should be mately 30% at the stated ambient temperature. This current is determined by placing verified in the end application. the compnent in the specified ambient environment and applying a short duration 5. Inductance tolerance is 20% for all parts except PA4341.151ANLT which is 30%. pulse current (to eliminate self-heating effect) to the component. 6. Parts shown in bold are standard catalog parts and are available through sample 3. The rated current is the DC current required to raise the component temperature by stock and distribution. Parts in lighter font are available but are not necessarily held approximately 40C. Take note that the components performanc varies depending in sample stock or distribution and lead times may be longer. Please contact Pulse on the system condition. It is suggested that the component be tested at the system for availablity. level, to verify the temperature rise of the component during system operation. Mechanical PA4341.XXXNLT C A D L A XXXANL E B D/C G T SUGGESTED PAD LAYOUT Final Layout Series A A B C D E T L G H PA4341.XXXANLT 7.10.3 6.40.3 6.60.2 2.80.2 1.60.3 3.00.2 0~0.15 8.0 3.7 3.4 All Dimensions in mm. TAPE & REEL INFO Blank portions Chip cavity Blank portions K P1 200mm or more 400mm or more G Direction of tape SURFACE MOUNTING TYPE, REEL/TAPE LIST REEL SIZE (mm) TAPE SIZE (mm) QTY A G P W K PCS/REEL 1 0 PA4341.XXXANLT 330 16.4+2/-0 12.00.1 160.3 3.30.1 1000 2 power.pulseelectronics.com P820. D (07/18)