PA4346.332ANLT Pulse

SMT Power Inductor High Current Molded Power Inductor - PA4346.XXXANLT Series Height: 5.0mm Max Footprint: 14.0mm x 12.8mm Max Current Rating: up to 50.0A Inductance Range: 0.22uH to 15.0uH Shielded construction and compact design High current, low DCR, and high efficiency Minimized acoustic noise and minimized leakage flux Electrical Specifications 25C - Operating Temperature -55C to +155C DC Saturation Inductance Rated Resistance Current Part 100KHz, 1V Current Mechanical Max. MAX. TYP. Number uH20% A m m A PA4346.221ANLT 0.22 50.0 0.61 0.50 60 Footprint 1 PA4346.471ANLT 0.47 34.0 0.9 0.77 58.0 Footprint 1 PA4346.681ANLT 0.68 31.0 1.55 1.3 42.0 Footprint 1 PA4346.102ANLT 1.00 27.0 1.9 1.6 34.0 Footprint 1 PA4346.152ANLT 1.50 22.0 3.8 3.2 28.0 Footprint 2 PA4346.222ANLT 2.20 15.5 4.8 4.0 23.0 Footprint 2 PA4346.332ANLT 3.30 14.0 7.0 6.0 20.5 Footprint 2 PA4346.472ANLT 4.70 12.5 10.2 8.8 16.0 Footprint 2 PA4346.682ANLT 6.80 11.0 16.0 13.0 15.0 Footprint 2 PA4346.103ANLT 10.0 9.0 22.0 19.2 10.5 Footprint 2 PA4346.153ANLT 15.0 8.2 36.0 30.0 9.2 Footprint 2 Notes: 1. Actual temperature of the component during system operation (ambient plus tempera- 3. The rated current is the DC current required to raise the component temperature by ture rise) must be within the standard operating range. approximately 40C. Take note that the components performanc varies depending on the 2. The saturation current is the current at which the initial inductance drops approximately system condition. It is suggested that the component be tested at the system level, to 30% at the stated ambient temperature. This current is determined by placing the com- verify the temperature rise of the component during system operation. ponent in the specified ambient environment and applying a short duration pulse cur- 4. The part temperature (ambient+temp rise) should not exceed 155C under worst case rent (to eliminate self-heating effect) to the component. operating conditions. Circuit design, PCB trace size and thickness, airflow and other cool- ing provisions all affect the part temperature. Part temperature should be verified in the end application. 0 SMT Power Inductor High Current Molded Power Inductor - PA4346.XXXANLT Series Mechanical PA4346.XXXANLT C A D B E Footprint 1 C A D L E B G Footprint 2 Final Layout SUGGESTED PAD LAYOUT Series Mechanical A B C D E L G H PA4346.XXXANLT Footprint 1 13.5 0.5 12.60.2 4.70.3 2.30.3 4.00.3 14.5 8.0 5.0 PA4346.XXXANLT Footprint 2 13.5 0.5 12.60.2 4.70.3 2.30.3 4.70.3 14.5 8.0 5.0 All Dimensions in mm. TAPE & REEL INFO Blank portions Chip cavity Blank portions K P1 200mm or more 400mm or more G Direction of tape SURFACE MOUNTING TYPE, REEL/TAPE LIST REEL SIZE (mm) TAPE SIZE (mm) QTY FYPE A G P W K PCS/REEL 1 0 PA4346.XXXANLT 330 24.4 16 24 5.5 500