X-On Electronics has gained recognition as a prominent supplier of RS1G32LF4D2BDS-53BT DRAM across the USA, India, Europe, Australia, and various other global locations. RS1G32LF4D2BDS-53BT DRAM are a product manufactured by Rayson. We provide cost-effective solutions for DRAM, ensuring timely deliveries around the world.

RS1G32LF4D2BDS-53BT Rayson

RS1G32LF4D2BDS-53BT electronic component of Rayson
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Part No.RS1G32LF4D2BDS-53BT
Manufacturer: Rayson
Category: DRAM
Description: FBGA-200 SDRAM ROHS
Datasheet: RS1G32LF4D2BDS-53BT Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 16.8337 ea
Line Total: USD 16.83 
Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Fri. 03 Jan to Wed. 08 Jan
MOQ : 1
Multiples : 1
1 : USD 16.8337
10 : USD 15.3395
30 : USD 14.103
100 : USD 13.025

   
Manufacturer
Product Category
Category
Rohs
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We are delighted to provide the RS1G32LF4D2BDS-53BT from our DRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the RS1G32LF4D2BDS-53BT and other electronic components in the DRAM category and beyond.

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The RS1G32LF4D2BDS-53BT with FBGA-200 is an SDRAM memory chip manufactured by Rayson. It is an advanced DDR4 SDRAM chip with a wide range of features and functions, including an ECC (Error Correction Code) calculation and 2D die stacking technology for high endurance and performance. It has a JEDEC-standard PBGA-200 package, with a restricted oven bake process, for reliable operation. It has RoHS compliance, and is able to operate at memory speeds of up to 3,200 megabits per second. This part is suitable for a variety of embedded systems, and is suitable for ruggedized applications.

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:
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