F2911NBGP Renesas

75 SPST RF Switch F2911 1MHz to 3500MHz Datasheet Description Features Low insertion loss: 0.33dB at 1200MHz The F2911 is a high reliability, low insertion loss, 75 SPST RF High isolation: 53dB at 1200MHz switch designed for a multitude of wireless and RF applications. This device covers a broad frequency range from 1MHz to Supply voltage: +2.7V to +5.5V 3500MHz. In addition to providing low insertion loss, the F2911 1.8V and 3.3V compatible control logic also delivers excellent linearity and isolation performance while -40C to +105C operating temperature range providing a 75 termination on one port in the isolation mode. 2mm x 2mm, 8-pin DFN package The F2911 uses a single positive supply voltage supporting either 3.3V or 1.8V control logic. Block Diagram Competitive Advantage Figure 1. Block Diagram The F2911 provides broadband RF performance to support the CATV market along with high power handling, and high isolation. V1 V Low insertion loss DD High isolation Excellent linearity Control Extended temperature range Circuit Typical Applications RF2 RF1 CATV Infrastructure CATV Set-Top Boxes 75 CATV Satellite Modems Data Network Equipment Fiber Networks 2017 Integrated Device Technology, Inc. 1 Rev O, September 21, 2017 F2911 Datasheet Pin Assignments Figure 2. Pin Assignments for 2mm x 2mm x 0.9mm 8-DFN Top View V RF2 V1 DD RF1 8 7 6 5 EP F2911 1 2 3 4 NC GND GND NC Pin Descriptions Table 1. Pin Descriptions Pin Name Function 1, 4 NC No internal connection. This pin may be connected to the exposed paddle and can be grounded. Ground. This pin is internally connected to the ground paddle. Ground this pin as close to the device as 2, 3 GND possible. RF1 port. This pin is matched to 75 in the insertion loss state only. If this pin is not 0V DC, then an 5 RF1 external coupling capacitor must be used. 6 V Power supply. Bypass to GND with capacitors as shown in the Figure 16 as close as possible to pin. DD 7 V1 Logic control pin. See Table 7 for proper logic setting. 8 RF2 RF2 port. Matched to 75. If this pin is not 0V DC, then an external coupling capacitor must be used. Exposed pad. This pad is internally connected to GND. Solder this exposed pad to a PCB pad that uses EP multiple ground vias to provide heat transfer out of the device and into the PCB ground planes. These multiple ground vias are also required to achieve the specified RF performance. 2017 Integrated Device Technology, Inc. 2 Rev O, September 21, 2017