DATASHEET HI5860 FN4654 Rev 7.00 12-Bit, 130MSPS, High Speed D/A Converter February 6, 2008 The HI5860 is a 12-bit, 130MSPS (Mega Samples Per Features Second), high speed, low power, D/A converter which is Throughput Rate 130MSPS implemented in an advanced CMOS process. Operating from a single +3V to +5V supply, the converter provides Low Power . 175mW at 5V, 32mW at 3V (At 100MSPS) 20mA of full scale output current and includes Integral Linearity Error (Typ) . 0.5 LSB edge-triggered CMOS input data latches. Low glitch energy Adjustable Full Scale Output Current . 2mA to 20mA and excellent frequency domain performance are achieved using a segmented current source architecture. Internal 1.2V Bandgap Voltage Reference This device complements the HI5x60 and HI5x28 family of high Single Power Supply from +5V to +3V speed converters, which includes 8-, 10-, 12-, and 14-bit Power-Down Mode devices. CMOS Compatible Inputs Pinout Excellent Spurious Free Dynamic Range HI5860 (28 LD SOIC, TSSOP) (76dBc, f = 50MSPS, f = 2.51MHz) S OUT TOP VIEW Excellent Multitone Intermodulation Distortion (MSB) D11 1 28 CLK Pb-Free Available (RoHS Compliant) D10 2 27 DV DD D9 3 26 DCOM Applications D8 4 25 ACOM Basestations (Cellular, WLL) D7 5 24 AV DD Medical/Test Instrumentation D6 6 23 COMP2 22 D5 7 IOUTA Wireless Communications Systems D4 8 21 IOUTB Direct Digital Frequency Synthesis D3 9 20 ACOM Signal Reconstruction D2 10 19 COMP1 D1 11 18 FSADJ High Resolution Imaging Systems (LSB) D0 12 17 REFIO Arbitrary Waveform Generators NC 13 16 REFLO NC 14 15 SLEEP Ordering Information PART NUMBER PART MARKING TEMP. RANGE (C) PACKAGE PKG. DWG. CLOCK SPEED HI5860IA* HI5860 IA -40 to +85 28 Ld TSSOP M28.173 130MHz HI5860IB HI5860IB -40 to +85 28 Ld SOIC M28.3 130MHz HI5860IBZ* HI5860IBZ -40 to +85 28 Ld SOIC (Pb-free) M28.3 130MHz (Note) HI5860SOICEVAL1 +25 Evaluation Platform 130MHz *Add -T suffix for tape and reel. Please refer to TB347 for details on reel specifications. NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets molding compounds/die attach materials and 100% matte tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. FN4654 Rev 7.00 Page 1 of 12 February 6, 2008HI5860 Typical Applications Circuit HI5860 (25) ACOM NC (13, 14) (15) SLEEP D11 D11 (1) DCOM (16) REFLO D10 D10 (2) ACOM (17) REFIO D9 D9 (3) 0.1F D8 D8 (4) D7 D7 (5) D6 D6 (6) (18) FSADJ D5 D5 (7) R 1.91k SET D4 D4 (8) (22) IOUTA D/A OUT D3 D3 (9) 50 D2 D2 (10) 50 D1 D1 (11) (21) IOUTB D/A OUT D0 D0 (LSB) (12) CLK (28) (23) COMP2 50 0.1F (19) COMP1 DCOM (26) (20) ACOM FERRITE 0.1F BEAD BEAD DV (27) +5V OR +3V (V ) DD (24) AV DD DD + + 10H 10H 10F 10F 0.1F 0.1F Functional Block Diagram IOUTA IOUTB (LSB) D0 D1 D2 CASCODE CURRENT D3 SOURCE D4 D5 7 LSBs 38 38 + LATCH SWITCH D6 LATCH 31 MSB MATRIX SEGMENTS D7 D8 UPPER 31 D9 5-BIT DECODER D10 COMP2 (MSB) D11 COMP1 CLK INT/EXT BIAS INT/EXT VOLTAGE SELECT GENERATION REFERENCE REFERENCE REFLO AV ACOM DV DCOM REFIO FSADJ SLEEP DD DD FN4654 Rev 7.00 Page 2 of 12 February 6, 2008