ISL6208CBZ Renesas

DATASHEET ISL6208, ISL6208B FN9115 Rev 7.00 High Voltage Synchronous Rectified Buck MOSFET Drivers July 14, 2014 The ISL6208 and ISL6208B are high frequency, dual MOSFET Features drivers, optimized to drive two N-Channel power MOSFETs in a Dual MOSFET drives for synchronous rectified bridge synchronous-rectified buck converter topology. They are especially suited for mobile computing applications that Adaptive shoot-through protection require high efficiency and excellent thermal performance. 0.5 On-resistance and 4A sink current capability These drivers, combined with an Intersil multiphase Buck Supports high switching frequency up to 2MHz PWM controller, form a complete single-stage core-voltage regulator solution for advanced mobile microprocessors. - Fast output rise and fall time - Low propagation delay ISL6208 and ISL6208B have the same function but different packages. The descriptions in this datasheet are based on Three-state PWM input for power stage shutdown ISL6208 and also apply to ISL6208B. Internal bootstrap schottky diode The ISL6208 features 4A typical sinking current for the lower Low bias supply current (5V, 80A) gate driver. This current is capable of holding the lower Diode emulation for enhanced light load efficiency and pre- MOSFET gate off during the rising edge of the Phase node. This biased start-up applications prevents shoot-through power loss caused by the high dv/dt of VCC POR (power-on-reset) feature integrated phase voltages. The operating voltage matches the 30V breakdown voltage of the MOSFETs commonly used in mobile Low three-state shutdown holdoff time (typical 160ns) computer power supplies. Pin-to-pin compatible with ISL6207 The ISL6208 also features a three-state PWM input that, QFN and DFN package: working together with Intersils multiphase PWM controllers, - Compliant to JEDEC PUB95 MO-220 will prevent negative voltage output during CPU shutdown. This QFN - Quad flat no leads - package outline feature eliminates a protective Schottky diode usually seen in DFN - Dual flat no leads - package outline a microprocessor power systems. - Near chip scale package footprint, which improves PCB MOSFET gates can be efficiently switched up to 2MHz using efficiency and has a thinner profile the ISL6208. Each driver is capable of driving a 3000pF load Pb-free (RoHS compliant) with propagation delays of 8ns and transition times under 10ns. Bootstrapping is implemented with an internal Schottky Applications diode. This reduces system cost and complexity, while allowing the use of higher performance MOSFETs. Adaptive Core voltage supplies for Intel and AMD mobile shoot-through protection is integrated to prevent both microprocessors MOSFETs from conducting simultaneously. High frequency low profile DC/DC converters A diode emulation feature is integrated in the ISL6208 to High current low output voltage DC/DC converters enhance converter efficiency at light load conditions. This High input voltage DC/DC converters feature also allows for monotonic start-up into pre-biased outputs. When diode emulation is enabled, the driver will allow discontinuous conduction mode by detecting when the Related Literature inductor current reaches zero and subsequently turning off the Technical Brief TB363 Guidelines for Handling and low side MOSFET gate. Processing Moisture Sensitive Surface Mount Devices (SMDs) Technical Brief TB389 PCB Land Pattern Design and Surface Mount Guidelines for MLFP Packages Technical Brief TB447 Guidelines for Preventing Boot-to-Phase Stress on Half-Bridge MOSFET Driver ICs FN9115 Rev 7.00 Page 1 of 13 July 14, 2014ISL6208, ISL6208B Ordering Information PART NUMBER PART TEMP. RANGE PACKAGE PKG. (Notes 3, 4) MARKING (C) (Pb-free) DWG. ISL6208CBZ (Note 1) ISL62 08CBZ -10 to +100 8 Ld SOIC M8.15 ISL6208CRZ (Note 1) 208Z -10 to +100 8 Ld 3x3 QFN L8.3x3 ISL6208BCRZ-T (Note 2) 8BC -10 to +100 8 Ld 2x2 DFN L8.2x2D ISL6208IBZ (Note 1) ISL62 08IBZ -40 to +100 8 Ld SOIC M8.15 ISL6208IRZ (Note 1) 8IRZ -40 to +100 8 Ld 3x3 QFN L8.3x3 ISL6208BIRZ-T (Note 2) 8BI -40 to +100 8 Ld 2x2 DFN L8.2x2D NOTES: 1. Add -T* suffix for tape and reel. Please refer to TB347 for details on reel specifications. 2. Please refer to TB347 for details on reel specifications. 3. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 4. For Moisture Sensitivity Level (MSL), please see device information page for ISL6208, ISL6208B. For more information on MSL please see techbrief TB363. Pin Configurations ISL6208CBZ, ISL6208IBZ ISL6208CRZ, ISL6208IRZ ISL6208BCRZ, ISL6208BIRZ (8 LD SOIC) (8 LD 3x3 QFN) (8 LD 2x2 DFN) TOP VIEW TOP VIEW TOP VIEW UGATE 1 8 PHASE 6 UGATE 1 8 PHASE BOOT 2 7 FCCM 8 7 2 BOOT 7 FCCM PWM 3 6 VCC 6 PWM 3 6 VCC 6 BOOT 1 6 FCCM GND 4 5 LGATE 4 5 LGATE GND PWM 2 5 VCC 3 4 Block Diagram VCC BOOT FCCM UGATE PHASE SHOOT- THROUGH PROTECTION CONTROL VCC PWM LOGIC LGATE 10k GND THERMAL PAD (FOR QFN AND DFN PACKAGE ONLY) FIGURE 1. BLOCK DIAGRAM ti FN9115 Rev 7.00 Page 2 of 13 July 14, 2014 GND UGATE LGATE PHASE