DATASHEET ISL8210M R16DS0013EU0101 Rev.1.01 10A High Efficiency Step-Down Power Module Feb 15, 2019 The ISL8210M power module is a single channel, Features synchronous step-down, non-isolated complete power R4 Technology supply featuring the proprietary Renesas R4 Linear control loop for optimal transient response Technology. The module supports a wide 4.5V to 16.5V input voltage range and a wide 0.5V to 5V output range Variable frequency and duty cycle control during capable of delivering up to 10A of continuous current load transient for fastest possible response and is optimized for high power density. Integrated Inherent voltage feed-forward for wide range LDOs provide module bias voltage, allowing for single input supply operation. Input voltage range: 4.5V to 16.5V The proprietary Renesas R4 control scheme has extremely fast transient performance, accurately Output voltage range: 0.5V to 5V regulated frequency control, and all internal 1.5% load and line regulation with remote sense compensation. An efficiency enhancing PFM mode Supports all ceramic solutions greatly improves light-load efficiency. The ISL8210M allows for easy R4 loop optimization, resulting in fast Integrated LDOs for single input rail solution transient performance across a wide range of 256 output voltage levels with a configuration pin applications, including all ceramic output filters. Seven switching frequency options from 300kHz to The power module integrates all power and most passive 1MHz components and requires only a few external components to operate. A set of optional external resistors provides PFM operation option for improved light-load very flexible configuration options (such as frequency, efficiency V , and AV gain). The ISL8210M also features remote OUT Start-up into precharged load voltage sensing and completely eliminates any potential Power-good monitor for soft-start and fault detection difference between remote and local grounds, improving regulation and protection accuracy. A programmable Comprehensive fault protection for high system soft-start reduces the inrush current from the input reliability supply. A precision enable input and power-good Over-temperature protection (PGOOD) flag are available to coordinate the start-up of the ISL8210M with other voltage rails, which is Output overcurrent and short-circuit protection especially useful for power sequencing. Excellent Output overvoltage and undervoltage protection efficiency and low thermal resistance permit full power operation without heatsinks. Open remote sense protection Input Undervoltage Lockout (UVLO), over-temperature, Input UVLO and power sequence as well as fault overcurrent, output overvoltage, and output prebias reset start-up protections ensure safe operations under Thermally enhanced 12mmx11mmx5.3mm HDA abnormal operating conditions. package The ISL8210M is available in a compact RoHS Related Literature compliant thermally-enhanced 12mmx11mmx5.3mm For a full list of related documents, visit our website: HDA package. ISL8210M device page Applications Servers, telecom, storage, and datacom Industrial/ATE and networking equipment Graphics cards General purpose power for ASIC, FPGA, DSP, and memory R16DS0013EU0101 Rev.1.01 Page 1 of 41 Feb 15, 2019ISL8210M Contents 1. Overview . 3 1.1 Typical Application Circuit . 3 1.2 Block Diagram 4 1.3 Ordering Information . 5 1.4 Pin Configuration 6 1.5 Functional Pin Descriptions 6 2. Specifications . 9 2.1 Absolute Maximum Ratings 9 2.2 Thermal Information 9 2.3 Recommended Operating Conditions 9 2.4 Electrical Specifications 10 3. Typical Performance Curves 13 3.1 Efficiency Performance 13 3.2 Output Voltage Ripple . 14 3.3 Load Transient Response Performance . 16 3.4 Start-Up and Shutdown 17 3.5 Derating Curves 18 4. Operating the ISL8210M . 20 4.1 Configuring Internal Bias and LDO . 20 4.2 Enabling and Disabling the ISL8210M . 20 4.3 Setting Up Resistors 21 4.4 Soft-Starting . 24 4.5 Output Voltage Programming . 24 4.6 Thermal Monitoring and Compensation 31 4.7 Fault Protection 33 4.8 PGOOD Monitor . 34 4.9 PFM Mode Operation . 34 5. Layout Guidelines 35 6. Thermal Considerations . 36 7. Package Description 37 7.1 PCB Layout Pattern Design . 37 7.2 Thermal Vias 37 7.3 Stencil Pattern Design . 37 7.4 Reflow Parameters . 38 8. Revision History 39 9. Package Outline Drawing 40 R16DS0013EU0101 Rev.1.01 Page 2 of 41 Feb 15, 2019