X28HC256 256k, 32k x 8-Bit Data Sheet September 21, 2011 FN8108.3 5V, Byte Alterable EEPROM Features The X28HC256 is a second generation high performance Access time: 70ns CMOS 32k x 8 EEPROM. It is fabricated with Intersils Simple byte and page write proprietary, textured poly floating gate technology, providing - Single 5V supply a highly reliable 5V only nonvolatile memory. - No external high voltages or V control circuits P-P The X28HC256 supports a 128-byte page write operation, - Self-timed effectively providing a 24s/byte write cycle, and enabling - No erase before write the entire memory to be typically rewritten in less than 0.8 - No complex programming algorithms seconds. The X28HC256 also features DATA Polling and - No overerase problem Toggle Bit Polling, two methods of providing early end of Low power CMOS write detection. The X28HC256 also supports the JEDEC standard Software Data Protection feature for protecting - Active: 60mA against inadvertent writes during power-up and power-down. - Standby: 500A Endurance for the X28HC256 is specified as a minimum Software data protection 1,000,000 write cycles per byte and an inherent data - Protects data against system level inadvertent writes retention of 100 years. High speed page write capability cell Highly reliable Direct Write - Endurance: 1,000,000 cycles - Data retention: 100 years Early end of write detection - DATA polling - Toggle bit polling Pb-free available (RoHS compliant) Block Diagram 256kBIT EEPROM X BUFFERS ARRAY LATCHES AND DECODER A TO A 0 14 ADDRESS INPUTS I/O BUFFERS Y BUFFERS AND LATCHES LATCHES AND DECODER I/O TO I/O 0 7 DATA INPUTS/OUTPUTS CE CONTROL OE LOGIC AND TIMING WE V CC V SS CAUTION: These devices are sensitive to electrostatic discharge follow proper IC Handling Procedures. 1 1-888-INTERSIL or 1-888-468-3774 Copyright Intersil Americas Inc. 2005-2007, 2010, 2011. All Rights Reserved Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries. All other trademarks mentioned are the property of their respective owners.X28HC256 Ordering Information ACCESS TIME TEMP. RANGE PART NUMBER PART MARKING (ns) (C) PACKAGE PKG. DWG. X28HC256J-15* X28HC256J-15 HY 0 to +70 32 Ld PLCC N32.45x55 X28HC256JZ-15* (Note) X28HC256J-15 ZHY 0 to +70 32 Ld PLCC (Pb-free) N32.45x55 X28HC256JI-15*, ** X28HC256JI-15 HY -40 to +85 32 Ld PLCC N32.45x55 X28HC256JIZ-15* (Note) X28HC256JI-15 ZHY -40 to +85 32 Ld PLCC (Pb-free) N32.45x55 X28HC256P-15**** X28HC256P-15 HY 0 to +70 28 Ld PDIP E28.6 X28HC256PZ-15*** (Note) X28HC256P-15 HYZ 0 to +70 28 Ld PDIP (Pb-free) E28.6 X28HC256PI-15**** X28HC256PI-15 HY -40 to +85 28 Ld PDIP E28.6 X28HC256PIZ-15*** (Note) X28HC256PI-15 HYZ -40 to +85 28 Ld PDIP (Pb-free) E28.6 X28HC256SI-15* X28HC256SI-15 HY -40 to +85 28 Ld SOIC (300 mil) MDP0027 X28HC256SIZ-15 (Note) X28HC256SI-15 HYZ -40 to +85 28 Ld SOIC (300 mil) (Pb-free) MDP0027 X28HC256J-12* X28HC256J-12 HY 0 to +70 32 Ld PLCC N32.45x55 X28HC256JZ-12* (Note) X28HC256J-12 ZHY 0 to +70 32 Ld PLCC (Pb-free) N32.45x55 X28HC256JI-12* X28HC256JI-12 HY -40 to +85 32 Ld PLCC N32.45x55 X28HC256JIZ-12* (Note) X28HC256JI-12 ZHY -40 to +85 32 Ld PLCC (Pb-free) N32.45x55 X28HC256P-12**** X28HC256P-12 HY 0 to +70 28 Ld PDIP E28.6 X28HC256PZ-12*** (Note) X28HC256P-12 HYZ 0 to +70 28 Ld PDIP (Pb-free) E28.6 X28HC256PI-12**** X28HC256PI-12 HY -40 to +85 28 Ld PDIP E28.6 X28HC256PIZ-12*** (Note) X28HC256PI-12 HYZ -40 to +85 28 Ld PDIP (Pb-free) E28.6 X28HC256S-12 X28HC256S-12 HY 120 0 to +70 28 Ld SOIC (300 mils) MDP0027 X28HC256SZ-12 (Note) X28HC256S-12 HYZ 0 to +70 28 Ld SOIC (300 mils) (Pb-free) MDP0027 X28HC256SI-12 X28HC256SI-12 HY -40 to +85 28 Ld SOIC (300 mils) MDP0027 X28HC256SIZ-12 (Note) X28HC256SI-12 HYZ -40 to +85 28 Ld SOIC (300 mils) (Pb-free) MDP0027 X28HC256JZ-90* (Note) X28HC256J-90 ZHY 0 to +70 32 Ld PLCC (Pb-free) N32.45x55 X28HC256JI-90* X28HC256JI-90 HY -40 to +85 32 Ld PLCC N32.45x55 X28HC256JIZ-90* (Note) X28HC256JI-90 ZHY -40 to +85 32 Ld PLCC (Pb-free) N32.45x55 X28HC256P-90**** X28HC256P-90 HY 90 0 to +70 28 Ld PDIP E28.6 X28HC256PZ-90*** (Note) X28HC256P-90 HYZ 0 to +70 28 Ld PDIP (Pb-free) E28.6 X28HC256PIZ-90 (Note) X28HC256PI-90 HYZ -40 to +85 28 Ld PDIP (Pb-free) E28.6 X28HC256S-90 X28HC256S-90 HY 0 to +70 28 Ld SOIC (300 mils) MDP0027 X28HC256SI-90 X28HC256SI-90 HY -40 to +85 28 Ld SOIC (300 mils) MDP0027 X28HC256SIZ-90 (Note) X28HC256SI-90 HYZ -40 to +85 28 Ld SOIC (300 mils) (Pb-free) MDP0027 *AddT1 suffix for tape and reel. **AddT2 suffix for tape and reel. ***Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications. ****Part at Prenotification (will become obsolete). NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. FN8108.3 2 September 21, 2011