Datasheet 3.0 V to 36 V Input, 2.0 A Integrated FET Single Synchronous Quiescent Operating Current Buck DC/DC Converter for Automotive BD9P233MUF-C General Description Key Specifications BD9P233MUF-C is an ultra-low IQ Buck converter for 3.3 Input Voltage Range: 3.0 V to 36 V V output. The LLM (Light Load Mode) control ensures an (initial startup is 3.6 V or more) ultra-low quiescent current and high efficiency at light Output Voltage: 3.3 V load situation as well as at high load situations while Switching Frequency: 200 kHz to 2.4 MHz maintaining a regulated output voltage. Output Current: 2 A (Max) Shutdown Circuit Current: 10 A (Max) (25 C) Quiescent Operating Current: 26 A (Typ) (25 C) Features Operating Temperature Range: -40 C to +125 C Nano Pulse Control (Note 1) AEC-Q100 Qualified Low Dropout: 100 % ON Duty Cycle Package W (Typ) x D (Typ) x H (Max) Light Load Mode (LLM) VQFN32FAV050: 5.0 mm x 5.0 mm x 1.0 mm Spread Spectrum Function Adjustable Frequency Synchronization by External Clock Thermal Shutdown Protection Input Under Voltage Lockout Protection Over Current Protection Output Over Voltage Protection Cl os e-up Power Good Output (Note 1) Grade 1 Applications Automotive Battery Powered Supplies (Cluster Panel, Car infotainment) VQFN32FAV050 Industrial/Consumer Supplies Wettable Flank Package Typical Application Circuit PVIN SW V V IN L O 1 PVIN SW CO C IN SW PVIN VIN VOUT VOUT VREGB C VREGB RT COMP R RT R1 C1 V EN EN C 2 V SYNC VREG3 SYNC C VREG3 V SPS SPS SS C SS V FPWM FPWM PGOOD R 2 GND PGND Nano Pulse Control is a trademark of ROHM Co., Ltd. Product structure : Silicon integrated circuit This product has no designed protection against radioactive rays. www.rohm.com TSZ02201-0J1J0AL01460-1-2 2019 ROHM Co., Ltd. All rights reserved. 1/43 TSZ22111 14 001 19.Jul.2019 Rev.001 BD9P233MUF-C Pin Configuration (TOP VIEW) C.N.C. EXP-PAD 32 31 30 29 28 27 26 25 PVIN 1 24 PGND PVIN 2 23 PGND 3 22 PVIN PGND 4 21 VIN SYNC EXP-PAD VREGB 5 20 PGOOD N.C. 19 6 N.C. EN 7 18 SPS FPWM 8 17 N.C. 9 10 11 12 13 14 15 16 EXP-PAD EXP-PAD Pin Description Pin No. Pin Name Function 1,2,3 PVIN Power supply input for output FET. 4 VIN Power supply input. Internal regulator output. Used as supply to driver circuits for high side FET. Do not 5 VREGB connect to any external loads. Connect a 1.0 F ceramic capacitor from this pin to the VIN pin. The voltage between the VIN pin and the VREGB pin is 4.8 V (Typ). 6 N.C. No internal connection pin. Enable input. The device is active when this pin is high and shutdown when this pin is low. 7 EN EN slew rate should be faster than 1 V/ms. 8 FPWM Forced PWM mode select pin. Internal regulator output. It supplies power to internal blocks. It cannot connect to external 9 VREG3 loads except FPWM, SPS and a pull-up resistor to PGOOD. Connect a 1.0 F ceramic capacitor from this pin to GND. 10,11 VOUT Feedback input to regulator. Connect to the output voltage sense point. 12 GND Reference ground. 13 COMP Error amplifier output. Connect frequency compensation parts. 14 SS Soft start time set pin. Connect a ceramic capacitor between this pin and GND. 15 RT Switching frequency setting pin. Connect a resistor between this pin and GND. 16,17 N.C. No internal connection pin. 18 SPS Spread spectrum select pin. It should be connected to GND when this pin is not used. 19 N.C. No internal connection pin. An open drain output. Connect a pull-up resistor. Output high indicates normal state of 20 PGOOD regulator output and low indicates the error state. Synchronization signal input pin. Used to synchronize the switching frequency with the 21 SYNC system clock. It should be connected to GND when this pin is not used. 22,23,24 PGND Power ground pin. It is connected to internal low side FET. Connect to GND. 25,26 N.C. No internal connection pin. 27,28,29 SW The output of internal MOSFET. Connect to power inductor. 30 N.C. No internal connection pin. Exposed pad. This pin can be connected to PGND through the center EXP-PAD. 31 EXP-PAD For details, refer to directions for pattern layout of PCB on page 36. No internal connection pin. This pin can be connected to PGND through the center 32 N.C. EXP-PAD. For detail, refer to directions for pattern layout of PCB on page 36. - C.N.C. Corner no internal connection pin. This pin should not be connected to any other lines. Exposed pad. Connect center EXP-PAD to the internal PCB ground plane using multiple - EXP-PAD via, it will provide excellent heat dissipation characteristics. Three corner EXP-PADs and pin 31 are connected to center EXP-PAD with internal frame. The N.C. pin 6, 26 and 30 should not be connected to any other lines for the safety against adjacent inter-pin shorts. The N.C. pin 16, 17, 19 and 25 can be connected to GND or opened. www.rohm.com TSZ02201-0J1J0AL01460-1-2 2019 ROHM Co., Ltd. All rights reserved. 2/43 TSZ22111 15 001 19.Jul.2019 Rev.001 VREG3 N.C. VOUT EXP-PAD VOUT N.C. GND SW COMP SW SS SW RT N.C. N.C. N.C.