Ver. 201312 Metal Composite Type Power Inductor CIGW252010GM1R0MNE (2520/ EIA 1008) APPLICATION Mobile Phones, LCD & AMOLED Display, HDD, SSD etc. FEATURES RECOMMENDED LAND PATTERN High Current Type Low DC resistance Magnetically shielded structure Free of all RoHS-regulated substances Monolithic structure for high reliability DIMENSION Dimension mm TYPE L W T D 22 2.50.2 2.00.2 0.90.1 0.550.25 DESCRIPTION DC 1 2 Rated Current (A) Rated Current (A) Size Inductance Resistance( ) Part no. (inch/mm) (uH) 1MHz Typ. Max. Typ. Max. Typ. Max. CIGW252010GM1R0MNE 1008/2520 1.0 20 % 0.040 0.052 3.7 3.3 3.5 3.3 1 Rated Current (A) : DC current value when Inductance drops by 30% of nominal Inductance value (ONLY REFERENCE) 2 Rated Current (A) : DC current value when the self-generation of heat rises to 40 (Reference ambient temperature:25 ) Operating temperature range: 40 to +125C ( Including self-temperature rise) Test equipment: Agilent :E4991A+16092A CHARACTERISTIC DATA 1) Temperature characteristics (Typ.) 2) DC Bias characteristics (Typ.)Ver. 201312 PRODUCT IDENTIFICATION CIG W 2520 10 GM 1R0 M N E (1) (2) (3) (4) (5) (6) (7) (8) (9) Power Inductor Type W: Winding Type) (1) (2) ( Dimension mm mm) Thickness Max mm) (3) (2520: 2.5 x 2.0 (4) (10: 1.0 Remark GM: General Metal Composite) Inductance R0: uH) (5) ( (6) (1 1.0 Tolerance M: (7) ( 20%) Initial Code (8) Packaging(C:paper tape, E:embossed tape) (9) RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING FLOW SOLDERING PACKAGING Packaging Style Quantity(pcs/reel) Embossed Taping 3,000pcs Any data in this sheet are subject to change, modify or discontinue without notice. The data sheets include the typical data for design reference only. If there is any question regarding the data sheets, please contact our sales personnel or application engineers.