X-On Electronics has gained recognition as a prominent supplier of K4E6E304EC-EGCG DRAM across the USA, India, Europe, Australia, and various other global locations. K4E6E304EC-EGCG DRAM are a product manufactured by SAMSUNG. We provide cost-effective solutions for DRAM, ensuring timely deliveries around the world.

K4E6E304EC-EGCG SAMSUNG

K4E6E304EC-EGCG electronic component of SAMSUNG
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See Product Specifications
Part No.K4E6E304EC-EGCG
Manufacturer: SAMSUNG
Category: DRAM
Description: FBGA-178 DDR SDRAM ROHS
Datasheet:
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 26.676 ea
Line Total: USD 26.68

Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Fri. 02 Aug to Wed. 07 Aug
MOQ : 1
Multiples : 1
1 : USD 18.5166
10 : USD 17.7949
30 : USD 16.5425
100 : USD 15.4514

   
Manufacturer
Product Category
Category
Rohs
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We are delighted to provide the K4E6E304EC-EGCG from our DRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the K4E6E304EC-EGCG and other electronic components in the DRAM category and beyond.

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The K4E6E304EC-EGCG with FBGA-178 DDR SDRAM ROHS is a Double Data Rate Synchronous Dynamic Random Access Memory (DDR SDRAM) chip produced by Samsung. It has a 178-pin Fine Ball Grid Array (FBGA) packaging, making it ideal for use in mobile, embedded, and industrial designs. The chip is RoHS (Restriction of Hazardous Substances) compliant, offering reduced environmental impact and ensuring safety. It has a maximum clock speed of 533 MHz, a memory density of 512 Megabits, a maximum row activation time of 15 ns, and an I/O voltage of 1.8V. The power consumption of this ROHS-compliant chip is only 1.8W, making it an energy-efficient solution for various applications.

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:
Samsung ARTIK
SAMSUNG ELECTRO-MECH
Samsung Electro-Mechanics
Samsung Electro-Mechanics America, Inc.
SAMSUNG GVI
SAMSUNG LED
SAMSUNG PASSIVES
SAMSUNG SDI
SAMSUNG SEMI
Samsung Semiconductor
Samsung Semiconductor, Inc.
SMP

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