X-On Electronics has gained recognition as a prominent supplier of K4F6E3S4HM-MGCJT Multichip Packages across the USA, India, Europe, Australia, and various other global locations. K4F6E3S4HM-MGCJT Multichip Packages are a product manufactured by SAMSUNG. We provide cost-effective solutions for Multichip Packages, ensuring timely deliveries around the world.

K4F6E3S4HM-MGCJT SAMSUNG

K4F6E3S4HM-MGCJT electronic component of SAMSUNG
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See Product Specifications
Part No.K4F6E3S4HM-MGCJT
Manufacturer: SAMSUNG
Category: Multichip Packages
Description: FBGA Memory - Serial MCP (Multi Chip Package) ROHS
Datasheet:
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 11.9575 ea
Line Total: USD 11.96 
Availability - 450
Ship by Fri. 03 Jan to Wed. 08 Jan
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
450
Ship by Fri. 03 Jan to Wed. 08 Jan
MOQ : 1
Multiples : 1
1 : USD 11.9575
10 : USD 10.4306
30 : USD 9.4987
100 : USD 8.7181

   
Manufacturer
Product Category
Package
Rohs
LoadingGif
 
Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the K4F6E3S4HM-MGCJT from our Multichip Packages category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the K4F6E3S4HM-MGCJT and other electronic components in the Multichip Packages category and beyond.

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory
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