X-On Electronics has gained recognition as a prominent supplier of K4F8E304HB-MGCJT Multichip Packages across the USA, India, Europe, Australia, and various other global locations. K4F8E304HB-MGCJT Multichip Packages are a product manufactured by SAMSUNG. We provide cost-effective solutions for Multichip Packages, ensuring timely deliveries around the world.

K4F8E304HB-MGCJT SAMSUNG

K4F8E304HB-MGCJT electronic component of SAMSUNG
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See Product Specifications
Part No. K4F8E304HB-MGCJT
Manufacturer: SAMSUNG
Category: Multichip Packages
Description: FBGA Memory - Serial MCP (Multi Chip Package) ROHS
Datasheet:
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 10.0679 ea
Line Total: USD 10.07 
Availability - 26
Ship by Fri. 18 Apr to Wed. 23 Apr
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
26
Ship by Fri. 18 Apr to Wed. 23 Apr
MOQ : 1
Multiples : 1
1 : USD 10.0679
10 : USD 7.3968
30 : USD 7.1718
100 : USD 6.9821

   
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We are delighted to provide the K4F8E304HB-MGCJT from our Multichip Packages category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the K4F8E304HB-MGCJT and other electronic components in the Multichip Packages category and beyond.

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory
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