F-214 DPAM2307.0S82A DPAF2303.0S82A (2,16 mm) .085 DPAM, DPAF SERIES HIGH DENSITY DIFFERENTIAL PAIR ARRAY DPAM Mates with: PAIRS PLATING NO. OF SOLDER DPAF OPTION DPAM 07.0 A PER ROW OPTION ROWS TYPE DPAF Mates with: DPAM SPECIFICATIONS 8 =Eight 04, 06 2 K S For complete speci cations and Pair = Lead-Free =(20,00 mm) 0.80 recommended PCB layouts see =30 (0,76 m) 08, 15, 23 Rows Tin Alloy DIA Polyimide www.samtec.com DPAM or Gold on contact area, www.samtec.com DPAF 96.5% Sn/ lm Pick & Tin on solder tail 3% Ag/.5% Cu Place Pad 3 Insulator Material: Solder Crimp =Three Black LCP Contact Material: Pair TR Copper Alloy Rows =Tape & Reel Perimeter Plating: G1 Grounds (TYP) Au over 50 (1,27 m) Ni (2,54) GP Current Rating (2x3): .100 2.9 A per pin =Guide Post Operating Temp Range: (23 only) A -55C to +125C Contact Resistance: 10.4m (2,54) Working Voltage: .100 02 01 G2 03 04 NO OF Signal Pairs (TYP) 300 VAC A ROWS Mated Cycles: 100 Cycles No. of positions x (2,16) .085 + (4,34) .171 DPAM/DPAF RoHS Compliant: Yes (24,59) .968 Rated 3dB Insertion Loss* 8 10 mm Stack Height Lead-Free Solderable: Yes (11,89) .468 (6,66) (0,13) 3 Single-Ended Signaling 8 GHz / 16 Gbps .262 .005 Differential Pair Signaling 7 GHz / 14 Gbps RECOGNITIONS (1,27) (2,16) .085 *Performance data includes effects of a non-optimized PCB050 For complete scope of (1,27) (1,08) .0425 DIA Complete test data available at www.samtec.com DPAM, .050 recognitions see www.samtec.com DPAF or contact sig samtec.com No. of positions x (2,16) .085 + (2,95) .116 www.samtec.com/quality PAIRS PLATING NO. OF SOLDER OPTION DPAF 03.0 A PER ROW OPTION ROWS TYPE 8 K =Eight =(20,00 mm) S 2 Pair Rows 0.80 DIA =30 (0,76 m) = Lead-Free Tin Alloy 04, 06, 08, Polyimide Gold on contact area, 96.5% Sn/ 3%Ag/ 15, 23 lm Tin on solder tail 3 .5% Cu Pick & =Three Solder Crimp Place Pad Pair Rows No. of positions x (2,16) .085 + (4,34) .171 G1 Signal Pairs TR USABLE PAIRS NO OF (TYP) SIZE =Tape A PER ARRAY* ROWS & Reel 6 Pairs 04 x 3 A 04 (23,32) 8 ALSO AVAILABLE 06 x 3 12 Pairs .918 (2,54) 02 (1,52) .100 (MOQ Required) 01 (10,62) 04 x 8 16 Pairs .060 3 .418 06 x 8 32 Pairs G2 03 (1,27) .050 Perimeter Grounds (TYP) Tin-Lead Solder Charge 08 x 8 48 Pairs DPAF DPAM Other platings 104 Pairs MATED 15 x 8 LEAD HEIGHT* 168 Pairs (6,45) (0,13) 23 x 8 Contact Samtec. STYLE .254 .005 03.0 08 x 3 18 Pairs 10 mm 15 x 3 39 Pairs 07.0 Note: Patented (2,16) .085 (1,27) 63 Pairs *Processing 23 x 3 Solder crimped on tail .050 (1,08) .0425 (1,27) Note: Some sizes, styles and conditions will DIA *Assumes rst and last pair in .050 No. of positions x (2,16) .085 + (2,95) .116 affect mated height. options are non-standard, each row are grounded non-returnable. WWW.SAMTEC.COM Fibre Channel Rapid I/O PCI Express SATA InfiniBand XAUI MGT (Rocket I/O) Download app notes at www.samtec.com/appnote Contact SIG samtec.com for questions on protocols Protocols SupportedX-ON Electronics Largest Supplier of Electrical and Electronic Components Click to view similar products for Board to Board & Mezzanine Connectors category: Click to view products by Samtec manufacturer: Other Similar products are found below : 589158040000018 MDF7C-18P-2.54DSA(55) FCN-230C068-11 FCN-268F012-G/BD FCN-268F036-G/BD FCN-268M012-G/0D FCN- 268M024-G/1D FCN-723J004/1 MIS-048-01-F-D-DP-K 832-10-034-10-001000 FX4C-80S-1.27DSA FCN-214Q030-G/0 FCN-234P048-G/0 FCN-235D050-G/C 210-93-314-41-105000 2-22603-0 MDF7-40DP-2.54DSA(55) AXG720047 5031084030 MIT-114-03-F-D-K 55323- 1519 DF33-2P-3.3DSA(24) YFT-20-05-H-03-SB-K 503308-3040 026-6203-PDB 027-6203-PDB 069159702701000 10123981-102LF 101A10019X 55650-0588-C 68684-306 75140-7012 589159005003045 194261-1 FCN-268F024-G0D 10124054-515LF 68685-603 8- 1616154-3 MIS-019-01-F-D 589159005002045 541371078 IL-WX-10PB-HF-B-E1000E FCN-268M024-G/3D 20021832-06016C1LF KX15-20KLDL-E1000E MDF7-16DP-2.54DSA(55) AXE810124 FCN-214J100-G/0 FCN-230C068-E/S AXE812124