HPM-02-02-T-S Samtec

MAX 16.1 Amps POWER HEADERS, STACKERS & SOCKETS (5.08 mm) .200 PITCH HPM, HPW, HPF SERIES HPM, HPW LEAD PLATING OTHER NO. OF PINS S TAIL OPTION HPM Board Mates: - - STYLE - OPTION - - - OPTION HPF High Temp Leave blank for Specifiy 01 thru 20 T P High Power Through-hole HPF LEAD = Matte Tin = Pick & Place Header Board Mates: STYLE Pad (3 Pos. min.) RA (VS only) from HPM, HPW = Right-angle (Not Available chart (-02 & -04 lead style only) with -05 below lead style) VS SPECIFICATIONS = Surface Mount (2 pins/row minimum) (2.54) Insulator Material: (-01 & -02 lead style only) .100 HPW/HPM = Glass Filled No. of Positions x (5.08) .200 Polyester (Through-hole), Natural Liquid Crystal Polymer LEAD A B C D E F G (Surface Mount) E STYLE B F HPF = Black LCP C 01 (4.57) .180 (11.94) .470 (10.72) .422 (8.64) .340 Terminal Material (HPM/HPW): 02 (4.57) .180 (13.21) .520 (2.54) .100 (4.57) .180 (8.08) .318 (12.24) .482 (8.38) .330 Copper Alloy (2.54) .100 Contact Material (HPF): A D 04 (4.09) .161 (21.06) .829 (4.95) .195 (3.96) .156 (13.82) .544 G BeCu (6.35) 05 (4.57) .180 (3.81) .150 Plating: .250 RA VS Sn over 50 (1.27 m) Ni Operating Temp Range: -55 C to +105 C Voltage Rating: HPM/HPF = 850 VAC/1200 NO. OF PLATING STACK POST OTHER VDC 04 S HPW - - - - - - - PINS OPTION HEIGHT HEIGHT OPTIONS Insertion Depth (HPF): (3.68 mm) .145 to (8.26 mm) .325 (.368 (9.35 mm) plus High Leave blank for board thickness minimum for 02 thru 20 T XXX XXX Temp Through-hole bottom entry) = Stacker = Post Height = Matte Tin High Wiping Distance (HPF): Height (in (in inches) Power (0.38 mm) .015 VS inches) = Surface Mount (0.13 mm) .005 (2 pins/row minimum) increments PROCESSING P = Pick & Place Pad LeadFree Solderable: (3 Pos. min.) (6.98 mm) STACK STACK HPW-VS, HPM-VS, HPF = Yes POST .275 min. post height HEIGHT HEIGHT HEIGHT (2.54) (34.29) (29.21) 1.15 HPM -TH, HPM -RA & (32.00) 1.26 (VS only) (0.00) 1.35 MAX WITH .100 MAX HPW -TH = No, Lead Wave only .000 (0.00) .000 MAX (5.08) .200 MIN POST MIN SMT Lead Coplanarity: (7.62) .300 MIN HPM = (0.20 mm) (2.29) .090 .008 max (02-15)* HPM = (0.25 mm) .010 max (16-20)* HPW = (0.20 mm) .008 max* HPF = (0.15 mm) .006 max PLATING (02-10)* NO. OF PINS LEAD STYLE OTHER OPTIONS HPF S - - - - - OPTION (0.20 mm) .008 max (11-20)* *(.004 stencil solution may be available contact IPG samtec.com) 02 thru 20 01 T LC TR = Through-hole = Matte Tin = Locking Clip = Tape & Reel (Manual Packaging placement (14 positions max.) 02 required) (Style 02 only) = Surface Mount (02 lead style only) FR = Full Reel No. of Positions x (5.08) .200 K Tape & Reel = (6.50 mm) (must order max. (5.08) .200 .256 DIA quantity per reel Polyimide contact Samtec film Pick for quantity & Place Pad breaks) (8.89) (14 positions max.) .350 Note: (Style -02 only) Some lengths, styles and options are non-standard, 02 01 non-returnable. F-221 (Rev 26APR21) samtec.com HPM, samtec.com HPW or samtec.com HPF Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtecs specifications which are subject to change without notice.X-ON Electronics Largest Supplier of Electrical and Electronic Components Click to view similar products for Power to the Board category: Click to view products by Samtec manufacturer: Other Similar products are found below : 6450171-4 6450552-7 6600323-8 6643429-1 6646040-2 6651939-1 6766604-1 120959-1 1393557-2 1393532-2 1393532-3 1393532-4 1393557-1 1600812-5 1-6450861-2 1744132-7 1761122-1 1766250-1 1892109-1 2-6450860-5 2-6450870-0 1-6450161-4 1-6450850-6 1- 6450869-6 1645526-2 1-6600130-0 2005243-2 377-0020-11130 TE34-12-16P-F0 51700-10201602AALF 5-6450830-6 5646956-4 377- 0080-11131A 4-6450830-9 4-6600333-3 10125416-4050LF 10130248-005LF 6600320-3 3-6450860-5 1888123-2 6450166-1 6643978-1 6766605-1 701-15-02109 N11444 6651938-1 6450810-7 46437-1112 1-1589677-8 5646956-5