HSEC8-130-01-S-PV-2-2 Samtec

HIGH-SPEED EDGE CARD SYSTEMS 0.60 mm, 0.80 mm and 1.00 mm PITCH FEATURES & BENEFITS 56 Gbps PAM4 performance PCI Express 3.0, 4.0 and 5.0 Edge Rate contacts optimized for signal integrity performance and cycle life Up to 200 positions available Vertical, right-angle, edge mount, pass-through orientations Power/signal combo, press-fit tails, rugged weld tabs, locks and latches Mating cable assemblies available Rugged tucked Differential pair for Custom designs allow beam technology increased speed for misalignment in (HTEC8) (HSEC8-DP) the X-Y axes (HSEC1) KEY SPECIFICATIONS TOTAL INSULATOR CONTACT OPERATING CURRENT VOLTAGE LEAD-FREE SERIES PITCH POSITIONS MATERIAL MATERIAL TEMP RANGE RATING RATING SOLDERABLE HSEC6 0.60 mm 56-168 Black LCP Copper Alloy -55 to +125 0.8 A (12 pins) 300 VAC Yes HTEC8 0.80 mm 40-200 Black LCP Copper Alloy -55 to +125 3.0 A (2 pins) 215 VAC Yes HSEC8 0.80 mm 18-200 Black LCP BeCu -55 to +125 2.8 A (2 pins) 240 VAC Yes HSEC1 1.00 mm 20-140 Black LCP Phosphor Bronze -55 to +125 2.2 A (2 pins) 215 VAC Yes View complete specifications at: samtec.com HSEC6-DV F-221 samtec.com/EdgeCard samtec.com/EdgeCard Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtecs specifications which are subject to change without notice.(0.80 mm) .0315 PITCH PASS-THROUGH & POWER COMBO POSITIONS CARD PLATING OTHER HSEC8 1 DV A PE - PER ROW - THICKNESS - OPTION - - - - OPTIONS 10, 13, 20 01 L K = (1.60 mm) .062 = 10 (0.25 m) = (5.50 mm) thick card Gold on contact .217 DIA area, Matte Tin Polyimide Film on tail Pick & Place Pad S TR = 30 (0.76 m) =Tape & Reel Gold on contact Packaging area, Matte Tin No. of Positions x on tail FR (0.80) .0315 + (7.00) .276 = Full Reel HSEC8-PE Tape & Reel Packaging No. of Positions x (Must order max. Card Mates: (0.80) .0315 + (7.00) .276 (7.00) quantities per reel276 (1.60 mm) .062 Contact Samtec for thick card, parts per reel) (7.00) .276 HSC8 (4.60) .180 (4.60) .180 (9.12) .359 (9.12) .359 No. of Positions x (0.80) .0315 + (4.60) .181 No. of Positions x (0.80) .0315 + (4.60) .181 View complete specifications at: samtec.com HSEC8-DV SIGNAL CARD PLATING POWER POWER OTHER HSEC8 1 PV - POSITIONS - THICKNESS - OPTION - - POSITIONS - TAIL - OPTION 20, 30, 40 01 L 2, 4 1 WT (Signal positions = (1.60 mm) .062 = 10 (0.25 m) (Total, 2 per = Use with = Weld Tab per row) thick card Gold on contact power bank) (1.60 mm) area, Matte Tin .062 Thick on tail PCB 2 S = Use with = 30 (0.76 m) (2.36 mm) Gold on contact .093 Thick area, Matte Tin PCB on tail A A A (8.00) HSEC8-PV (8.00) .315 (8.00) .315 .315 Card Mates: B (1.60 mm) .062 B (8.00) B (8.00) thick card .315 (8.00) .315 .315 (15.03) (15.21) (15.03) (15.21) .592 .599 (15.03) .592 (15.21).599 .592 .599 D D C D C C POWER POSITIONS SIGNAL POWER A B C A B C POSITIONS D TAIL (2) (2) (2) (4) (4) (4) 20 (32.10) 1.264 (15.20) .598 (18.20) .717 (44.10) 1.736 (15.20) .598 (18.20) .717 1 (2.35) .093 30 (40.10) 1.579 (23.20) .913 (26.20) 1.031 (52.10) 2.051 (23.20) .913 (26.20) 1.031 2 (3.13) .123 40 (48.10) 1.894 (31.20) 1.228 (34.20) 1.346 (60.10) 2.366 (31.20) 1.228 (34.20) 1.346 Note: Some sizes, styles and options are non-standard, non-returnable. View complete specifications at: samtec.com HSEC8-PV samtec.com/EdgeCard F-221 Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtecs specifications which are subject to change without notice.