LSH03001GDA
LSH05001GDA
F-213
LSH01001GDA
LTH01001GDA
(0,50 mm) .0197"
LTH03001GDA
LTH05001GDA
LTH, LSH SERIES
LOW PROFILE BLADE AND BEAM
SPECIFICATIONS
PLATING OTHER
NO. OF POSITIONS
LTH 01 D A
OPTION OPTION
PER ROW
For complete speci cations and
recommended PCB layouts see
www.samtec.com?LTH or
www.samtec.com?LSH
Mates with: LSH
Insulator Material:
Liquid Crystal
Polymer
K
G
Terminal Material:
= (5,50 mm) .217" DIA
010, 020, 030, 040, 050 = 10" (0,25 m)
Phosphor Bronze
Polyimide Film
Contact Material: Gold
Pick & Place Pad
BeCu
Plating: (No. of positions per row +2)
Au over 50" (1,27 m) Ni x (0,50) .01969 + (2,79) .110
Current Rating:
TR
1.5A per contact
(1,91)
(1,27) = Tape and Reel
(0,76)
@ 80C ambient
.075
.030 .050
01
Operating Temp Range:
-55C to +125C
(4,80)
RoHS Compliant:
.189
Yes
02
(0,50) (0,20)
Processing: .01969 .008
(1,68)
(1,55)
Lead-Free Solderable:
.066
(0,76)
.061
No
.030
SMT Lead Coplanarity:
(0,10 mm) .004" max
Board Stacking:
(0,76)
(5,05)
For applications requiring more
.030
.199
than two connectors per board,
DIA
contact ipg@samtec.com
(No. of positions per row +2)
x (0,50) .01969 + (1,27) .050
MATED HEIGHT
LEAD MATED
STYLE HEIGHT*
(2,31) .091
01
NO. OF POSITIONS PLATING OTHER
*Processing conditions will
LSH 01 D A
affect mated height. PER ROW OPTION OPTION
Mates with: LTH
K
G
= (7,50 mm) .295" DIA
= 10" (0,25 m)
010, 020, 030, 040, 050
Polyimide Film Pick &
Gold
Place Pad
(No. of positions per row + 2)
x (0,50) .01969 + (4,06) .160
TR
= Tape and Reel
(0,74)
(1,22)
.029
02
.048
(6,50)
.256
01
(0,15)
(0,50)
.01969 .006
(1,91)
Note: Samtec recommends (0,76)
.075
right-side-up, single-pass .030
63/37 Tin/Lead re ow
soldering for these connectors.
(0,76)
This product is not compatible
.030
(6,73)
with lead-free re ow soldering.
DIA
.265
(No. of positions per row + 2)
x (0,50) .01969 + (1,91) .075
Note: Some lengths,
styles and options are
non-standard, non-returnable.
WWW.SAMTEC.COMX-ON Electronics
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