F-219
MEC113002LDEM2
MEC112002FDEM2
MEC112002LDRA1SL
(1.00 mm) .0394" MEC1-RA, MEC1-EM SERIES
RIGHT-ANGLE/EDGE MOUNT SOCKETS
SPECIFICATIONS
POSITIONS CARD PLATING
1
MEC1 D RA1 NP SL
For complete specifications and PER ROW SLOT OPTION
recommended PCB layouts see
www.samtec.com?MEC1-RA
Insulator Material: Black LCP
Mates with:
Contact Material:
F POSITIONS POLARIZED
02
(1.60 mm)
Phosphor Bronze
PER ROW POSITIONS
= Gold flash
= (1.60 mm)
.062" card NP
Plating: Au or Sn over
05, 08, 20, 30, on contact, 05 3, 4
.062"
= No Polarization
50 (1.27 m) Ni
Matte Tin
thick card 08 5, 6
Current Rating: 1.6 A per pin (8 positions only)
40, 50, 60, 70
on tail
(2 adjacent pins powered)
20 15, 16
Leave Blank for
Operating Temp Range:
30 21, 22
polarization
-55 C to +125 C
L
31, 32
40
Insertion Depth:
= 10
(5.84 mm) .230" to (8.13 mm) .320"
50 41, 42
(0.25 m)
(11.68)
RoHS Compliant: Yes
(11.96)
60 31, 32, 63 & 64
Gold on
.460
(8.89) .471
contact, 70 53, 54, 115 & 116
.350
PROCESSING
ALSO
Matte Tin
AVAILABLE
on tail
LeadFree Solderable: Yes Note: While optimized for 50 W
(No. of Positions + 2) x
(MOQ Required)
SMT Lead Coplanarity: applications, this connector with
(1.00) .03937 + (2.54) .100
(0.10 mm) .004" max (05-40) alternative signal/ground patterns
(8.13)
Elevated body
(0.15 mm) .006" max (50-70)* (0.36) .014 may also perform well in certain
02
.320
height
*(.004" stencil solution 75 W applications.
may be available; contact
Other platings
(6.81)
IPG@samtec.com)
.268
(0.91)
.036
01
(1.00)
RECOGNITIONS (1.78)
HIGH-SPEED CHANNEL PERFORMANCE
.03937
(0.91)
(2.51)
.070
(1.52)
(No. of Positions + 2) .036
.099
For complete scope of DIA
MEC1-RA
.060
x (1.00) .03937
recognitions see
Rating based on Samtec reference channel.
www.samtec.com/quality
Note: Some sizes, styles and For full SI performance data visit Samtec.com
14
options are non-standard, or contact SIG@samtec.com
Gbps
non-returnable.
FILE NO. E111594
APPLICATION
Samtec recommends that pads
on the mating board be Gold plated.
SPECIFICATIONS
POSITIONS PLATING
1
MEC1 02 D EM2 NP
For complete specifications and PER ROW OPTION
recommended PCB layouts see
www.samtec.com?MEC1-EM
Insulator Material:
Mates with:
Black LCP
Contact Material: (1.60 mm)
Phosphor Bronze
.062" card
NP
F
Plating:
05, 08, 20, 30,
= No Polarization
= Gold flash on contact,
Au or Sn over
(8 positions only)
50 (1.27 m) Ni 40, 50, 60, 70 Matte Tin on tail
Current Rating:
Leave Blank for
ALSO
1.8 A per pin
(No. of Positions + 2) x
L
polarization
(2 adjacent pins powered)
AVAILABLE
(1.00) .03937 + (12.45) .490
= 10 (0.25 m) Gold on contact,
Operating 02
(MOQ Required)
Matte Tin on tail
Temp Range:
-55 C to +125 C
Edge mount leads
(6.81)
POSITIONS POLARIZED
Insertion Depth:
.268
for (0.80 mm) .031"
Note: While optimized for 50 W applications,
PER ROW POSITIONS
(5.84 mm) .230" to
thick board
this connector with alternative signal/ground
(8.13 mm) .320"
01 05 3, 4
patterns may also perform well in certain
Other platings
RoHS Compliant:
(No. of Positions + 2)
75 W applications. 08 5, 6
Yes
x (1.00) .03937
20 15, 16
LeadFree Solderable:
Yes
30 21, 22
(8.13)
(8.89) 40 31, 32
.320
RECOGNITIONS
.350
50 41, 42
31, 32, 63
For complete scope of
60
(4.70)
& 64
recognitions see (5.21)
.185
.205
www.samtec.com/quality
Note: Some sizes,
53, 54, 115
70
(1.19) (0.38)
styles and options & 116
(4.57) (3.15)
(0.36) .047 .015
are non-standard,
.124
.180 (1.00)
.014
FILE NO. E111594 non-returnable.
.03937
Due to technical progress, all designs, specifications and components are subject to change without notice.
WWW.SAMTEC.COM
All parts within this catalog are built to Samtecs specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.X-ON Electronics
Largest Supplier of Electrical and Electronic Components
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