COM Express Type 6 COM Express Compact 3.0 Type 6 Module with the AMD Ryzen COMe-B75-CT6 Embedded V1000 processors Next Generation x86 Zen Core and elite GPU performance HIGHLIGHTS CONNECTIVITY CPU 4x USB 3.0 8x USB 2.0 4x PCI-e x1 Gen 3, PEG AMD Ryzen Embedded V1000 processors x8 Gen3 GRAPHICS MEMORY AMD Radeon Vega GPU with up to 11 Compute Up to two DDR4 SO-DIMM Slots supporting DDR4- Units DirectX 12 supported 3200 ECC Memory Available in Industrial Temperature Range DEVELOPMENT SAMPLING PRODUCTION MAIN FIELDS OF APPLICATION Biomedical/ Digital Signage - Gaming Medical devices Infotainment FEATURES AMD Ryzen Embedded V1807B with AMD Radeon Vega 11 Graphics, Up to 4x PCI-e x1 Gen3 lanes + 2 x PCI-e x1 Gen2 ports PCI-e Quad Core Dual Thread 3.35GHz (3.8 Boost), TDP 35-54W PCI-express Graphics (PEG) x 8 Gen3 AMD Ryzen Embedded V1756B with AMD Radeon Vega 8 Graphics, Audio HD Audio interface Quad Core Dual Thread 3.25GHz (3.6 Boost), TDP 35-54W AMD Ryzen Embedded V1605B with AMD Radeon Vega 8 Graphics, Serial Ports 2 x UARTs Quad Core Dual Thread 2.0GHz (3.6 Boost), TDP 12-25W Processor AMD Ryzen Embedded V1202B with AMD Radeon Vega 3 Graphics, SPI, I2C bus, SM Bus, LPC bus, FAN management Dual Core Dual Thread 2.3 GHz (3.2 Boost), TDP 12-25W Other LID /SLEEP /PWRBTN , Watchdog Interfaces 4x GPI, 4 x GPO AMD Ryzen Embedded V1404I with AMD Radeon Vega 3 Graphics, Quad Core / Single Thread, TDP 15W ,Industrial Power +12V 10% and + 5V (optional) DC SB Temperature range Supply Operating Microsoft Windows 10 Max Cores 4 System Linux Ubuntu Up to two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Operating 0C +60C (Commercial version) Memory Memory (DDR4-2400 with V1605B, V1202B and V1404I) -40C +85C (Industrial version) Temperature* AMD Radeon Vega GPU with up to 11 Compute Units Dimensions 95 x 95 mm (COM Express Compact Form factor, Type 6 pinout) DirectX 12 supported Graphics H.265 (10-bit) decode and 8-bit video encode VP9 decode *Measured at any point of SECO standard heastpreader for this product, during 4 independent displays supported any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application- 3 x Digital Display Interfaces (DDIs), supporting DP 1.3, DVI Video specific cooling solutions for the final system to keep the heatspreader temperature and HDMI 1.4/2.0 Interfaces in the range indicated. eDP or Single/Dual-Channel 18-/24- bit LVDS interface Video DDIs, eDP up to 4K Resolution LVDS up to 1920 x 1200 Mass Storage 2 x S-ATA Gen3 Channels Gigabit Ethernet interface Networking Intel I21x family GbE Controller 4 x USB 3.0 Host ports USB 8 x USB 2.0 Host ports www.seco.com Information subject to change. Please visit www.seco.com to find the latest version of this datasheetCOM Express Compact 3.0 Type 6 Module with the AMD Ryzen COMe-B75-CT6 Embedded V1000 processors BLOCK DIAGRAM ORDERING INFORMATION PN* DESCRIPTION MB75-1000-1111-C0 COMe-B75-CT6 w/AMD Ryzen Embedded - Ethernet Contr. I210 - EDP Port - FP5 Type 1 - Comm. Temp MB75-3001-2111-C0 COMe-B75-CT6 w/AMD Ryzen Embedded V1202B 2.5GHz - Ethernet Contr. I211 - EDP Port - HUB - Packet Switch - Comm. Temp MB75-4001-2111-C0 COMe-B75-CT6 w/AMD Ryzen Embedded V1605B 2.0GHz - Ethernet Contr. I211 - EDP Port - HUB - Packet Switch - Comm. Temp MB75-6001-2111-C0 COMe-B75-CT6 w/AMD Ryzen Embedded V1807B 3.35GHz - Ethernet Contr. I211 - EDP Port - HUB - Packet Switch - Comm. Temp *Additional configurations may be available. Please inquire for more information. ACCESSORIES PN DESCRIPTION MC30-0000-0000-C0 Carrier board for COM Express Type 6 modules on 3.5 form factor M965-0000-0000-C0 CCOMe-965 - mini ITX Carrier Board for COM-Express Type 6 modules M965-CEXDK-0000 COM Express Type 6 Cross Platform Development Kit MB75-DISS-1-PK COMe-B75-CT6 Heat Spreader (PASSIVE) MB75-DISS-3-PK COM Express Type 6 - COMe-B75-CT6 Heat Sink (ACTIVE) www.seco.com Information subject to change. Please visit www.seco.com to find the latest version of this datasheet 297.18