EClamp2410P ESD Protection Device for T-Flash/MicroSD Interfaces TM PRPROOTECTION PRTECTION PRODUCTODUCTSS - EMIClamp PRELIMINARY Features Description TM The EClamp 2410P is a combination EMI lter and line Bidirectional EMI/RFI ltering and line termination termination device with integrated TVS diodes for use on with integrated ESD protection Multimedia Card interfaces. This state-of-the-art de- ESD protection to IEC 61000-4-2 (ESD) Level 4, vice utilizes solid-state silicon-avalanche technology for 15kV (air), 8kV (contact) superior clamping performance and DC electrical char- TVS working voltage: 5V acteristics. They have been optimized for protection of Termination Resistors: 45 T-Flash/MicroSD interfaces in cellular phones and other Pull Up Resistors: 15k (3 each) and 50k portable electronics. Typical Capacitance per Line: 12pF (VR = 2.5V) The device consists of six circuits that include series im- Protection and termination for six lines + Vdd pedance matching resistors and pull up resistors as re- quired by the SD speci cation. TVS diodes are included Solid-state technology on each line for ESD protection. An additional TVS diode Mechanical Characteristics connection is included for protection of the voltage (Vdd) bus. Termination resistor value of 45 Ohms is included SLP4016P16 16-pin package on the DAT0, DAT1, DAT2, DAT3, CMD, and CLK lines. RoHS/WEEE Compliant Pull up resistors of 15k Ohms are included on DAT0, Nominal Dimensions: 4.0 x 1.6 x 0.58 mm DAT1, DAT2, and CMD lines while a 50k Ohm pull up is Lead Pitch: 0.5mm inlcuded on the DAT3 line. These may be con gured for Lead nish: NiPd devices operating in SD or SPI mode . The TVS diodes Marking: Marking Code provide effective suppression of ESD voltages in excess Packaging: Tape and Reel per EIA 481 of 15kV (air discharge) and 8kV (contact discharge) per IEC 61000-4-2, level 4. Applications The EClamp2410P is in a 16-pin, RoHS/WEEE compliant, T-Flash / MicroSD Interfaces SLP4016P16 package. It measures 4.0 x 1.6 x 0.58mm. The leads are spaced at a pitch of 0.5mm and are n- MMC Interfaces ished with lead-free NiPd. CDMA, GSM, 3G Cell Phones Pin Con guration Package Con guration 4.00 1 2 DAT1 In 1 16 DAT1 O u t DAT0 In 1.60 DAT0 O u t CL K In CL K O u t R up1 R up3 Vdd R up2 0.50 BSC CMD In CMD O u t DAT3 In DAT3 O u t DAT2 In DAT2 O u t 0.58 Pin Designation (Top View) 16 Pin SLP package (Bottom Side View) Nominal Dimensions in mm www.semtech.com Revision 07/20/2006 1EClamp2410P PRELIMINARY PROTECTION PRODUCTS Pin Identi cation and Con guration Pin Symbol Identi cation 1, 16 DAT1 Data line 1 input/output with pull-up resistor 16 15 14 13 12 1110 9 2, 15 DAT0 Data line 0 input/output with pull-up resistor 3, 14 Clock Clock line Input/Output 4 Rup1 15k Pull-up resistor from DAT1 & DAT2 12 34 5 6 7 8 5 Vdd Power Supply ESD Protection 6, 11 CMD Command Line Input/Output Pin Con guration (Top View) 7, 10 DAT3 Data line 3 input/output with pull-up resistor 8, 9 DAT2 Data line 2 input/output with pull-up resistor 12 Rup2 50k Pull-Up Resistor from DAT3 13 Rup3 15k Pull-up resistor from DAT0 & CMD Center GND Ground connection tab Schematics & Component Values Pin 12 Pin 4 Rup Rup 15K 50K 45 Ohms Pin 1, 8 45 Ohms Pin 9, 16 Pin 7 Pin 10 DAT1, DAT2 DAT3 Pin 13 DAT0, CMD Line Pin 5 Pin 3 45 Ohms Pin 14 Rup 15K 45 Ohms Pin 2, 6 Pin 11, 15 Vdd CLK DAT0, CMD www.semtech.com 2006 Semtech Corp. 2