RClamp0524PQ Low Capacitance RailClamp 4-Line Surge and ESD Protection PROTECTION PRODUCTS Description Features Transient Protection to RailClamp TVS arrays are ultra low capacitance ESD s IEC 61000-4-2 (ESD) 25kV (Air), 15kV (Contact) protection devices designed to protect high speed data s IEC 61000-4-4 (EFT) 4kV (5/50ns) interfaces. This series has been spec cally designed to s IEC 61000-4-5 (Lightning) 5A (8/20s) protect sensitive components which are connected to s ISO-10605 (ESD) 20kV (Air), 12kV (Contact) high-speed data and transmission lines from overvoltage Qual ed to AEC-Q100, Grade 1 caused by ESD (electrostatic discharge), CDE (Cable Protects four High-Speed Data Lines Working Voltage: 5V Discharge Events), and EFT (electrical fast transients). Low Capacitance: 0.8 pF Maximum (I/O to GND) Dynamic Resistance: 0.43 Ohms (Typ) RClamp0524PQ has a typical capacitance of only 0.3 pF Solid-State Silicon-Avalanche Technology between I/O pins. This allows it to be used on circuits operating in excess of 3GHz with no sign cant signal Mechanical Characteristics attenuation. ESD characteristics are highlighted by high SLP2510P8 Package ESD withstand voltage (+/-15kV per IEC 61000-4-2) and Pb-Free, Halogen Free, RoHS/WEEE Compliant low dynamic resistance (0.43 Ohms typical). Each device Nominal Dimensions: 2.5 x 1.0 x 0.58 mm will protect four lines operating at 5 volts Lead Finish: NiPdAu Molding Compound Flammability Rating: UL 94V-0 Marking : Marking Code + Date Code RClamp0524PQ is in a 10-pin SLP2510P8 package and Packaging : Tape and Reel o is qual ed to AEC-Q100, Grade 1 (-40 to +125 C) for automotive applications. It measures 2.5 x 1.0 mm with Applications a nominal height of only 0.58 mm. The leads are nished Automotive Applications with lead-free NiPdAu. The ow- through package design Industrial Equipment simpl es PCB layout. HDMI Digital Visual Interface MDDI Ports PCI Express Nominal Dimension Functional Schematic , & + % % % + 6&6 A * . 0 % Device Schematic Nominal Dimensions in mm RClamp0524PQ 1 of 10 www.semtech.com Final Datasheet Rev 2.0 Semtech Revision date June 22, 2015Absolute Maximum Rating Rating Symbol Value Units Peak Pulse Power (tp = 8/20s) P 75 W PK Peak Pulse Current (tp = 8/20s) I 5 A PP (1) ESD per IEC 61000-4-2 (Contact) 15 V kV (1) ESD ESD per IEC 61000-4-2 (Air) 25 (2) ESD per ISO-10605 (Contact) 12 V kV (2) ESD ESD per ISO-10605 (Air) 20 O Operating Temperature T -40 to +125 C J O Storage Temperature T -55 to +150 C STG O Electrical Characteristics (T=25 C unless otherwise speci ed) Parameter Symbol Conditions Min. Typ. Max. Units O O -40 C to 125 C Reverse Stand-O Voltage V 5 V RWM Any I/O pin to GND O I = 10mA, -40 C to t Reverse Breakdown Voltage V 6.5 9 11 V BR O Any I/O pin to GND 125 C O T = 25 C 0.1 A Reverse Leakage Current I V = 5V R RWM O T = 125 C 0.25 A I = 1A, tp = 8/20s, (3) PP Clamping Voltage V 12 V C Any I/O pin to GND I = 5A, tp = 8/20s, (3) PP Clamping Voltage V 15 V C Any I/O pin to GND I = 4A, tp = 0.2/100ns (TLP) (4) PP ESD Clamping Voltage V 12 V C Any I/O pin to GND I = 16A, tp = 0.2/100ns (TLP) (4) PP ESD Clamping Voltage V 17 V C Any I/O pin to GND tp = 0.2/100ns (TLP) (4), (5) Dynamic Resistance R 0.43 Ohms DYN Any I/O pin to GND O T = 25 C 0.4 0.8 V = 0V, f = 1MHz R O Any I/O pin to GND T=125 C 1.2 1.5 Junction Capacitance C pF J O T = 25 C 0.3 0.4 V = 0V, f = 1MHz R O Between I/O pins T = 125 C 0.5 0.7 Notes: (1): ESD Gun return path to Ground Reference Plane (GRP) (2): ESD Gun return path to Horizontal Coupling Plane (HCP) Test conditions: 330pF, 330. (3): Measured using an 8/20us constant current source. (4): Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, I and V averaging window: t = 70ns to t = 90ns. TLP TLP 1 2 (5): Dynamic resistance calculated from I = 4A to I = 16A TLP TLP RClamp0524PQ 2 of 10 www.semtech.com Final Datasheet Rev 2.0 Semtech Revision Date June 22, 2015