SR3.3 RailClamp Low Capacitance TVS Diode Array PROTECTION PRODUCTS Features Description RailClamps are surge rated diode arrays designed to ESD protection to protect high speed data interfaces. The SR series has IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact) been specifically designed to protect sensitive compo- IEC 61000-4-4 (EFT) 40A (5/50ns) nents which are connected to data and transmission Array of surge rated diodes with internal lines from overvoltage caused by electrostatic dis- EPD TVS diode charge (ESD), electrical fast transients (EFT), and Protects two I/O lines tertiary lightning. Low capacitance (<10pF) for high-speed interfaces The unique design of the SR series devices incorpo- Low leakage current (< 1A) rates four surge rated, low capacitance steering diodes Low operating voltage: 3.3V and a TVS diode in a single package. The TVS diode is Solid-state technology constructed using Semtechs proprietary low voltage Mechanical Characteristics EPD technology for superior electrical characteristics at 3.3 volts. JEDEC SOT-143 package During transient conditions, the steering diodes direct Molding compound flammability rating: UL 94V-0 the transient to either the positive side of the power Marking : R3.3 supply line or to ground. The internal TVS diode pre- Packaging : Tape and Reel vents over-voltage on the power line, protecting any downstream components. Applications The low capacitance array configuration allows the user Data and I/O lines to protect two high-speed data or transmission lines. Sensitive Analog Inputs The low inductance construction minimizes voltage Video Line Protection overshoot during high current surges. Portable Electronics Microcontroller Input Protection WAN/LAN Equipment Circuit Diagram Schematic & PIN Configuration Pin 4 4 1 Pin 2 Pin 3 2 3 Pin 1 SOT-143 (Top View) www.semtech.com Revision 01/16/08 1SR3.3 PROTECTION PRODUCTS Absolute Maximum Rating Rlating Seymbo Vsalu Unit PPeak Pulse Power (tp = 8/20s) 1s50 Watt pk PIeak Pulse Current (tp = 8/20s) 1A0 PP Peak Forward Voltage (I=V1A, tp=8/20s) 1V.5 F FP LTead Soldering Temperature 2C60 (10 sec.) L OTperating Temperature -C55 to +125 J STtorage Temperature -C55 to +150 STG Electrical Characteristics SR3.3 Plarameter SsymboCmondition MlinimuTmypicaMsaximu Unit RVeverse Stand-Off Voltage 3V.3 RWM PVunch-Through Voltage I=52A3V. PT PT SVnap-Back Voltage I=850mA2V. SB SB RIeverse Leakage Current V=13.3V, T=25C A R RWM CVlamping Voltage I=71A, tp = 8/20s V C PP CVlamping Voltage I=510A, tp = 8/20s 1V C PP JCunction Capacitance Between I/O pins and 601Fp j Ground V = 0V, f = 1MHz R Between I/O pins 3Fp V = 0V, f = 1MHz R www.semtech.com 2008 Semtech Corp. 2