SX1243 WIRELESS & SENSING DATASHEET SX1243 - Low Cost Low Current Integrated Transmitter 310 to 928MHz Frequency Agile GENERAL DESCRIPTION APPLICATIONS The SX1243 is an ultra-low-cost, fully integrated FSK or Garage Door Openers OOK transmitter suitable for operation between 310 and Low-Cost Consumer Electronic Applications 450 MHz, 860 and 870 MHz, as well as 902 and 928 MHz. Remote Keyless Entry (RKE) For applications where economy is paramount, the SX1243 may be used without the requirement for configuration via Remote Control / Security Systems an MCU. However, in conjunction with a microcontroller the communication link parameters may be re-configured. Including, output power, modulation format and operating KEY PRODUCT FEATURES channel. The SX1243 offers integrated radio performance with cost +10 dBm or 0 dBm Configurable output power efficiency and is suited for operation in North America FCC Bit rates up to 100 kbps Part 15.231, FCC Part 15.247 FHSS and Digital Modulation Techniques, 15.249, and Europe EN 300 220. OOK and FSK modulation. 1.8 to 3.7 V supply range. ORDERING INFORMATION Low BOM Fully Integrated Tx Part Number Temperature Range Package MOQ / Multiple Fractional-N PLL with 1.5 kHz typical step SX1243IULTRT -40 C to +85 C DFN-UT8 3000 pieces Frequency agility for FHSS modulation FCC CFR Part 15.247 Digital Modulation Techniques Pb-Free, Halogen Free, RoHS/WEEE compliant product. RFOUT NRESET 1 8 PA DATA TX READY 2 7 CP M/N CTRL GND 3 PFD 6 1.8 to 3.7 V Sigma XTAL VDD /Delta 4 5 Revision 4 - February 2013 Page 1 www.semtech.com 2013 Semtech CorporationSX1243 WIRELESS & SENSING DATASHEET Table of contents Section Page 1. Circuit Description ....................................................................................................................................................................... 3 1.1. General Description............................................................................................................................................................ 3 1.2. Block Diagram .................................................................................................................................................................... 3 1.3. Marking Diagram................................................................................................................................................................ 4 1.4. Pin Description, DFN8 Encapsulation ..................................................................................................................................... 5 2. Electrical Characteristics............................................................................................................................................................. 6 2.1. ESD Notice......................................................................................................................................................................... 6 2.2. Absolute Maximum Ratings................................................................................................................................................ 6 2.3. Operating Range................................................................................................................................................................ 6 2.4. Electrical Specifications ........................................................................................................................................................... 7 3. Digital Specification ..................................................................................................................................................................... 9 4. Application Modes of the SX1243 ............................................................................................................................................. 10 4.1. Transmitter Modes............................................................................................................................................................ 10 4.2. Mode Selection Flowchart ................................................................................................................................................ 11 4.3. Application Mode: Power & Go ............................................................................................................................................. 12 4.4. Application Mode: Advanced ............................................................................................................................................ 12 4.4.1. Advanced Mode: Configuration................................................................................................................................. 12 4.4.2. Frequency Hopping Spread Spectrum...................................................................................................................... 12 4.5. Frequency Band Coverage ................................................................................................................................................... 13 4.6. Power Consumption .............................................................................................................................................................. 14 5. SX1243 Configuration............................................................................................................................................................... 15 5.1. TWI Access....................................................................................................................................................................... 15 5.2. APPLICATION Configuration Parameters ........................................................................................................................ 17 5.3. FREQUENCY Configuration Parameters ......................................................................................................................... 17 5.4. Test Parameters ............................................................................................................................................................... 18 5.5. Status Parameters............................................................................................................................................................ 18 5.6. Recovery Command .............................................................................................................................................................. 19 6. Application Information.............................................................................................................................................................. 20 6.1. Crystal Specification......................................................................................................................................................... 20 6.2. Evaluation Module ............................................................................................................................................................ 20 6.3. NRESET Pin..................................................................................................................................................................... 22 6.4. TX READY Pin................................................................................................................................................................. 22 6.5. Low Power Optimization ................................................................................................................................................... 22 6.5.1. 2 Connections: CTRL, DATA .................................................................................................................................... 22 6.5.2. 3 Connections: CTRL, DATA, TX READY ............................................................................................................... 22 7. SX1243 Packaging.................................................................................................................................................................... 23 7.1. Package Outline Drawing ................................................................................................................................................. 23 7.2. Thermal Impedance.......................................................................................................................................................... 23 7.3. Land Pattern ..................................................................................................................................................................... 24 7.4. Tape & Reel Specification ................................................................................................................................................ 24 8. Revision History ........................................................................................................................................................................ 25 Revision 4 - February 2013 Page 2 www.semtech.com 2013 Semtech Corporation