SX8650 Worlds Lowest Power & Smallest Footprint 4-wire Resistive Touchscreen Controller with 15kV ESD ADVANCED COMMUNICATIONS & SENSING DATASHEET 4 KEY PRODUCT FEATURES GENERAL DESCRIPTION The SX8650 is an ultra low power 4-wire resistive Extremely Low Power Consumption: 23uA 1.8V 8kSPS touchscreen controller optimized for portable equipment Superior On-chip ESD Protection where power and board-space are at a premium. 15kV HBM (X+,X-,Y+,Y-) 2kV CDM It incorporates a highly accurate 12-bit ADC for data 25kV Air Gap Discharge conversion and operates from a single 1.65 to 3.7V supply 15kV Contact Discharge voltage. 300V MM The SX8650 features a built-in preprocessing algorithm for Single 1.65V to 3.7V Supply/Reference data measurements, which greatly reduces the host Integrated Preprocessing Block to Reduce Host Loading processing overhead and bus activity. This complete and Bus Activity touchscreen solution includes four user-selectable Four User Programmable Operation Modes provides operation modes which offer programmability on different Flexibility to address Different Application Needs configurations such as conversion rate and settling time, Manual, Automatic, Pen Detect, Pen Trigger thus enable optimization in throughput and power High Precision 12-bit Resolution consumption for a wide range of touch sensing applications. Low Noise Ratiometric Conversion The touch screen inputs have been specially designed to Selectable Polling or Interrupt Modes provide robust on-chip ESD protection of up to 15kV in both HBM and Contact Discharge, and eliminates the need Touch Pressure Measurement for external protection devices. 400kHz Fast-Mode IC Interface The SX8650 supports the Fast-mode IC (400kbit/s) s erial Hardware Reset & IC Software Reset bus data protocol and includes 2 user-selectable slave -40C to 85C Operation addresses. A custom I2C address is possible on request. 12-LD (3.0 mm x 3.0 mm) DFN Package The SX8650 is offered in two tiny packages: 3.0 mm x 12-Ball (1.5 mm x 2.0 mm) WLCSP Package 3.0 mm DFN and a 1.5 mm x 2.0 mm wafer-level chip-scale Pin-compatible with SX8651 package (WLCSP). Pb-Free, Halogen Free, RoHS/WEEE compliant product Windows CE 6.0, Linux Driver Support Available APPLICATIONS Portable Equipment ORDERING INFORMATION Mobile Communication Devices Part Number Package Cell phone, PDA, MP3, GPS, DSC 1 SX8650ICSTRT 12 - Ball WLCSP (1.5 mm x 2.0 mm) Touch Screen Monitors 1 SX8650IWLTRT 12 - Lead DFN (3.0 mm x 3.0 mm) Block Diagram 1. 3000 Units / reel SX8650 AUX VDD Control A0 X+ NRST POR OSC I2C Y+ SCL Touch X- Screen HOST Interface Y- SDA ref+ Digital in ADC out Filter Vref ref- GND NIRQ Revision V2.19/October 2010 Page 1 www.semtech.com 2010 Semtech Corp. SX8650 ADVANCED COMMUNICATIONS & SENSING DATASHEET Table of contents Section Page 1. General Description................................................................................................................................................. 4 1.1. DFN Pinout Diagram and Marking Information (Top View).............................................................................. 4 1.2. WLCSP Pinout Diagram and Marking Information (Top View) ........................................................................ 4 1.3. Pin Description................................................................................................................................................. 5 1.4. Simplified Block Diagram ................................................................................................................................. 5 2. Electrical Characteristics ......................................................................................................................................... 6 2.1. Recommended Operating Conditions.............................................................................................................. 6 2.2. Thermal Characteristics................................................................................................................................... 6 2.3. Electrical Specifications ................................................................................................................................... 7 2.4. Host Interface Specifications ........................................................................................................................... 9 2.5. Host Interface Timing Waveforms.................................................................................................................. 10 2.6. Typical Operating Characteristics .................................................................................................................. 11 3. Functional Description ........................................................................................................................................... 13 3.1. General Introduction ..................................................................................................................................... 13 3.2. Channel Pins.................................................................................................................................................. 13 3.2.1. X+, X-, Y+. Y- .......................................................................................................................................... 13 3.2.2. AUX......................................................................................................................................................... 13 3.3. Host Interface and Control Pins..................................................................................................................... 14 3.3.1. NIRQ ....................................................................................................................................................... 14 3.3.2. SCL ......................................................................................................................................................... 14 3.3.3. SDA......................................................................................................................................................... 14 3.3.4. A0............................................................................................................................................................ 15 3.3.5. NRST ...................................................................................................................................................... 15 3.4. Power Management Pins............................................................................................................................... 15 3.4.1. VDD......................................................................................................................................................... 15 3.4.2. GND ........................................................................................................................................................ 15 4. Detailed Description............................................................................................................................................... 16 4.1. Touch Screen Operation................................................................................................................................ 16 4.2. Coordinates Measurement............................................................................................................................. 17 4.3. Pressure Measurement.................................................................................................................................. 17 4.4. Pen Detection ................................................................................................................................................ 18 5. Data Processing .................................................................................................................................................... 19 5.1. Host Interface and Control ............................................................................................................................. 19 5.1.1. I2C Address ............................................................................................................................................ 19 5.1.2. I2C Write Registers ................................................................................................................................. 20 5.1.3. I2C Read Registers................................................................................................................................. 21 5.1.4. I2C Host Commands............................................................................................................................... 21 5.1.5. I2C Read Channels................................................................................................................................ 22 5.1.6. Data Channel Format............................................................................................................................. 23 Revision V2.19/October 2010 Page 2 www.semtech.com 2010 Semtech Corp.