X-On Electronics has gained recognition as a prominent supplier of HSP-8 Thermal Interface Products across the USA, India, Europe, Australia, and various other global locations. HSP-8 Thermal Interface Products are a product manufactured by Sensata. We provide cost-effective solutions for Thermal Interface Products, ensuring timely deliveries around the world.

HSP-8 Sensata

HSP-8 electronic component of Sensata
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See Product Specifications
Part No.HSP-8
Manufacturer: Sensata
Category: Thermal Interface Products
Description: Thermal Interface Products Thermal Pad for PM67 Series SSR
Datasheet: HSP-8 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 6.7105 ea
Line Total: USD 6.71 
Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Thu. 28 Nov to Mon. 02 Dec
MOQ : 1
Multiples : 1
1 : USD 6.7105
10 : USD 6.5142
50 : USD 6.2139
100 : USD 6.0291

   
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We are delighted to provide the HSP-8 from our Thermal Interface Products category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the HSP-8 and other electronic components in the Thermal Interface Products category and beyond.

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THERMAL PADS HSP-8 ACCESSORIES Features Thermal Pad suitable for NOVA22 PM67 Panel Mount SSRs Easy to use thermal interface material Excellent alternative to thermal grease GENERAL SPECIFICATIONS Description Parameters Material Chomerics T725 Color Pink Thickness inch (mm) 0.005 (0.127) Adhesive No Thermal Impedance C-in/W (1) 0.06 25 psi Thermal Conductivity W/m-K (1) 0.07 Flame Rating V0 Continuous Temperature Range C -55 to 125 Volume Resistivity Ohm-cm > 10 4 MOUNTING SURFACE PREPARATION The mounting surface, usually the heat sink, should be clean and free from machining oils and aluminum dust, and may be cleaned with any common solvent, such as isopropyl alcohol (IPA) if necessary. The surface of the heat sink may be anodized, chromate coated or unnished aluminum. INSTALLATION OF HSP-8 PADS HSP-8 material does not require pre-heating of the heat sink prior to installing the HSP-8 pad onto the heat sink, because of the phase change nature of the HSP-8 material, please follow the process temperature/pressure guidelines below to ensure the best results for a specic assembly process: Temperature / Pressure Process Step Recommended Range Removing pad from clear carrier liner Temp. of Roll: less than 38C (100F) Heat Sink Temp: 16C to 38C (60F to 100F) Installing pad onto cold heat sink Roll Temp: 21C to 38C (70F to 100F) Installation Pressure: 25 to 50 psi (2) Heat Sink Temp: 24C to 38C (75F to 100F) Installing pad onto warm heat sink Roll Temp: 21C to 38C (70F to 100F) Installation Pressure: 25 to 50 psi (2) Removing protective blue release liner Temp of Heat Sink/Pad Assembly: Less than 38C (100F) When removing the pull-tab, use a quick, lifting motion. This is preferable over peeling the pull-tab from the HSP-8 pad and heat sink. To ensure optimal wetting of the HSP-8 pad to the heat sink. It is recommended that the parts be allowed to dwell one hour prior to attempting release liner removal. Page 1 Copyright 2019 Sensata Technologies, Inc. www.sensata.comMECHANICAL SPECIFICATIONS Tolerances: 0.02 in / 0.5 mm All dimensions are in: inches Millimeters 0.00 2.38 -0.07 0 60.45 -1.65 CARRIER LINER YELLOW TAB .005 0.1 GENERAL NOTES (1) This value is provided for reference only. Follow installation instructions for accurate thermal performance. (2) Apply pressure to the HSP-8 pad with a soft press-pad for 2 to 3 seconds. WARNINGS RISK OF MATERIAL DAMAGE AND HOT ENCLOSURE The products side panels may be hot, allow the product to cool before touching. Follow proper mounting instructions including torque values. Do not allow liquids or foreign objects to enter this product. Failure to follow these instructions can result in serious injury, or equipment damage. HAZARD OF ELECTRIC SHOCK, EXPLOSION OR ARC FLASH Disconnect all power before installing or working with this equipment. Verify all connections and replace all covers before turning on power. Failure to follow these instructions will result in death or serious injury. Page 2 Sensata Technologies, Inc. (Sensata) data sheets are solely intended to assist designers (Buyers) who are developing systems that CONTACT US incorporate Sensata products (also referred to herein as components). Buyer understands and agrees that Buyer remains responsible for using its independent analysis, evaluation and judgment in designing Buyers systems and products. Sensata data sheets have Americas been created using standard laboratory conditions and engineering practices. Sensata has not conducted any testing other than that +1 (877) 502 5500 Option 2 specically described in the published documentation for a particular data sheet. Sensata may make corrections, enhancements, sales.crydom sensata.com improvements and other changes to its data sheets or components without notice. Europe, Middle East & Africa Buyers are authorized to use Sensata data sheets with the Sensata component(s) identied in each particular data sheet. HOWEVER, NO +44 (1202) 416170 OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER SENSATA INTELLECTUAL PROPERTY RIGHT, AND ssr-info.eu sensata.com NO LICENSE TO ANY THIRD PARTY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT, IS GRANTED HEREIN. SENSATA DATA SHEETS Asia Pacic ARE PROVIDED AS IS. SENSATA MAKES NO WARRANTIES OR REPRESENTATIONS WITH REGARD TO THE DATA SHEETS OR USE sales.isasia list.sensata.com OF THE DATA SHEETS, EXPRESS, IMPLIED OR STATUTORY, INCLUDING ACCURACY OR COMPLETENESS. SENSATA DISCLAIMS China +86 (21) 2306 1500 ANY WARRANTY OF TITLE AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, QUIET Japan +81 (45) 277 7117 ENJOYMENT, QUIET POSSESSION, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS WITH REGARD Korea +82 (31) 601 2004 TO SENSATA DATA SHEETS OR USE THEREOF. India +91 (80) 67920890 All products are sold subject to Sensatas terms and conditions of sale supplied at www.sensata.com SENSATA ASSUMES NO LIABILITY Rest of Asia +886 (2) 27602006 FOR APPLICATIONS ASSISTANCE OR THE DESIGN OF BUYERS PRODUCTS. BUYER ACKNOWLEDGES AND AGREES THAT IT IS SOLELY ext 2808 RESPONSIBLE FOR COMPLIANCE WITH ALL LEGAL, REGULATORY AND SAFETY-RELATED REQUIREMENTS CONCERNING ITS PRODUCTS, AND ANY USE OF SENSATA COMPONENTS IN ITS APPLICATIONS, NOTWITHSTANDING ANY APPLICATIONS-RELATED INFORMATION OR SUPPORT THAT MAY BE PROVIDED BY SENSATA. Mailing Address: Sensata Technologies, Inc., 529 Pleasant Street, Attleboro, MA 02703, USA. Copyright 2019 Sensata Technologies, Inc. www.sensata.com Rev. 08/09/19 ERN 20741 FDE-07-01 Rev.B 0.00 1.57 -0.03 0 39.86 -0.76

Tariff Desc

8547.9 TC 8535449 SHEETING OR SHAPES, electrically insulating, thermally conductive,
being combinations of two OR more of the following:
(a) silicone rubber;
(b) glass fibre;
(c) boron nitride;
(d) polyimide;
(e) copper
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SENSATA TECHNOLOGIES
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SENSATA/CRYDOM
SENSATA/CYNERGY3
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